JPWO2023026556A1 - - Google Patents
Info
- Publication number
- JPWO2023026556A1 JPWO2023026556A1 JP2023543670A JP2023543670A JPWO2023026556A1 JP WO2023026556 A1 JPWO2023026556 A1 JP WO2023026556A1 JP 2023543670 A JP2023543670 A JP 2023543670A JP 2023543670 A JP2023543670 A JP 2023543670A JP WO2023026556 A1 JPWO2023026556 A1 JP WO2023026556A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021138407 | 2021-08-26 | ||
| PCT/JP2022/013517 WO2023026556A1 (en) | 2021-08-26 | 2022-03-23 | Component mounting device, and determining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023026556A1 true JPWO2023026556A1 (en) | 2023-03-02 |
Family
ID=85322688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023543670A Pending JPWO2023026556A1 (en) | 2021-08-26 | 2022-03-23 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023026556A1 (en) |
| CN (1) | CN117546623A (en) |
| WO (1) | WO2023026556A1 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6424097B2 (en) * | 2015-01-20 | 2018-11-14 | ヤマハ発動機株式会社 | NOZZLE INSPECTION DEVICE, NOZZLE INSPECTION METHOD, AND COMPONENT CONVEYING DEVICE |
| JP7232985B2 (en) * | 2019-03-26 | 2023-03-06 | パナソニックＩｐマネジメント株式会社 | Component Mounting Device, Sliding State Measuring Device for Component Holding Section, and Sliding State Measuring Method for Component Holding Section |
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2022
- 2022-03-23 CN CN202280044288.5A patent/CN117546623A/en active Pending
- 2022-03-23 JP JP2023543670A patent/JPWO2023026556A1/ja active Pending
- 2022-03-23 WO PCT/JP2022/013517 patent/WO2023026556A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023026556A1 (en) | 2023-03-02 |
| CN117546623A (en) | 2024-02-09 |