JPWO2023026388A1 - - Google Patents

Info

Publication number
JPWO2023026388A1
JPWO2023026388A1 JP2023543544A JP2023543544A JPWO2023026388A1 JP WO2023026388 A1 JPWO2023026388 A1 JP WO2023026388A1 JP 2023543544 A JP2023543544 A JP 2023543544A JP 2023543544 A JP2023543544 A JP 2023543544A JP WO2023026388 A1 JPWO2023026388 A1 JP WO2023026388A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023543544A
Other languages
Japanese (ja)
Other versions
JP7568118B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023026388A1 publication Critical patent/JPWO2023026388A1/ja
Application granted granted Critical
Publication of JP7568118B2 publication Critical patent/JP7568118B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current
    • H02H3/087—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current for DC applications
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
    • H03K17/0812—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
    • H03K17/08122—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit in field-effect transistor switches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
JP2023543544A 2021-08-25 2021-08-25 車載用の半導体スイッチ装置 Active JP7568118B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/031121 WO2023026388A1 (ja) 2021-08-25 2021-08-25 車載用の半導体スイッチ装置

Publications (2)

Publication Number Publication Date
JPWO2023026388A1 true JPWO2023026388A1 (https=) 2023-03-02
JP7568118B2 JP7568118B2 (ja) 2024-10-16

Family

ID=85321886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023543544A Active JP7568118B2 (ja) 2021-08-25 2021-08-25 車載用の半導体スイッチ装置

Country Status (4)

Country Link
US (1) US20240429911A1 (https=)
JP (1) JP7568118B2 (https=)
CN (1) CN117795673A (https=)
WO (1) WO2023026388A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021796A (ja) * 2006-07-12 2008-01-31 Renesas Technology Corp 半導体装置およびその製造方法
JP2008294384A (ja) * 2007-04-27 2008-12-04 Renesas Technology Corp 半導体装置
JP2017174951A (ja) * 2016-03-23 2017-09-28 ローム株式会社 半導体装置
WO2018198957A1 (ja) * 2017-04-24 2018-11-01 ローム株式会社 半導体装置
JP2019198171A (ja) * 2018-05-09 2019-11-14 株式会社フジクラ 電力供給装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021796A (ja) * 2006-07-12 2008-01-31 Renesas Technology Corp 半導体装置およびその製造方法
JP2008294384A (ja) * 2007-04-27 2008-12-04 Renesas Technology Corp 半導体装置
JP2017174951A (ja) * 2016-03-23 2017-09-28 ローム株式会社 半導体装置
WO2018198957A1 (ja) * 2017-04-24 2018-11-01 ローム株式会社 半導体装置
JP2019198171A (ja) * 2018-05-09 2019-11-14 株式会社フジクラ 電力供給装置

Also Published As

Publication number Publication date
JP7568118B2 (ja) 2024-10-16
WO2023026388A1 (ja) 2023-03-02
US20240429911A1 (en) 2024-12-26
CN117795673A (zh) 2024-03-29

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