JPWO2023022179A1 - - Google Patents

Info

Publication number
JPWO2023022179A1
JPWO2023022179A1 JP2023542430A JP2023542430A JPWO2023022179A1 JP WO2023022179 A1 JPWO2023022179 A1 JP WO2023022179A1 JP 2023542430 A JP2023542430 A JP 2023542430A JP 2023542430 A JP2023542430 A JP 2023542430A JP WO2023022179 A1 JPWO2023022179 A1 JP WO2023022179A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023542430A
Other versions
JPWO2023022179A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023022179A1 publication Critical patent/JPWO2023022179A1/ja
Publication of JPWO2023022179A5 publication Critical patent/JPWO2023022179A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2023542430A 2021-08-20 2022-08-17 Pending JPWO2023022179A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021135043 2021-08-20
JP2022032024 2022-03-02
PCT/JP2022/031116 WO2023022179A1 (ja) 2021-08-20 2022-08-17 半導体モジュールおよびその製造方法、電子装置、電子モジュール、ならびに電子装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023022179A1 true JPWO2023022179A1 (ja) 2023-02-23
JPWO2023022179A5 JPWO2023022179A5 (ja) 2023-12-22

Family

ID=85239847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023542430A Pending JPWO2023022179A1 (ja) 2021-08-20 2022-08-17

Country Status (4)

Country Link
JP (1) JPWO2023022179A1 (ja)
KR (1) KR20240046499A (ja)
TW (1) TW202322323A (ja)
WO (1) WO2023022179A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9443824B1 (en) * 2015-03-30 2016-09-13 Qualcomm Incorporated Cavity bridge connection for die split architecture
US10622311B2 (en) * 2017-08-10 2020-04-14 International Business Machines Corporation High-density interconnecting adhesive tape
US10510721B2 (en) * 2017-08-11 2019-12-17 Advanced Micro Devices, Inc. Molded chip combination
US10651126B2 (en) * 2017-12-08 2020-05-12 Applied Materials, Inc. Methods and apparatus for wafer-level die bridge
US11289424B2 (en) * 2018-11-29 2022-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Package and method of manufacturing the same
US11735533B2 (en) 2019-06-11 2023-08-22 Intel Corporation Heterogeneous nested interposer package for IC chips
US20210005542A1 (en) 2019-07-03 2021-01-07 Intel Corporation Nested interposer package for ic chips
US11854984B2 (en) * 2019-09-25 2023-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and manufacturing method thereof
US11094637B2 (en) * 2019-11-06 2021-08-17 International Business Machines Corporation Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers
US11239167B2 (en) * 2019-12-04 2022-02-01 International Business Machines Corporation Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate

Also Published As

Publication number Publication date
WO2023022179A1 (ja) 2023-02-23
KR20240046499A (ko) 2024-04-09
TW202322323A (zh) 2023-06-01

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