JPWO2022269668A1 - - Google Patents

Info

Publication number
JPWO2022269668A1
JPWO2022269668A1 JP2023529199A JP2023529199A JPWO2022269668A1 JP WO2022269668 A1 JPWO2022269668 A1 JP WO2022269668A1 JP 2023529199 A JP2023529199 A JP 2023529199A JP 2023529199 A JP2023529199 A JP 2023529199A JP WO2022269668 A1 JPWO2022269668 A1 JP WO2022269668A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023529199A
Other languages
Japanese (ja)
Other versions
JP7570517B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022269668A1 publication Critical patent/JPWO2022269668A1/ja
Application granted granted Critical
Publication of JP7570517B2 publication Critical patent/JP7570517B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023529199A 2021-06-21 2021-06-21 Component transfer device and component placement machine Active JP7570517B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023341 WO2022269668A1 (en) 2021-06-21 2021-06-21 Component transfer device and component mounting machine

Publications (2)

Publication Number Publication Date
JPWO2022269668A1 true JPWO2022269668A1 (en) 2022-12-29
JP7570517B2 JP7570517B2 (en) 2024-10-21

Family

ID=84544267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529199A Active JP7570517B2 (en) 2021-06-21 2021-06-21 Component transfer device and component placement machine

Country Status (3)

Country Link
JP (1) JP7570517B2 (en)
DE (1) DE112021007857T5 (en)
WO (1) WO2022269668A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2502822B2 (en) * 1991-03-01 1996-05-29 松下電器産業株式会社 Electronic component mounting method
JPH06209194A (en) * 1993-01-12 1994-07-26 Matsushita Electric Ind Co Ltd Electronic component mounting method
JPH0779097A (en) 1993-09-07 1995-03-20 Matsushita Electric Ind Co Ltd Mounting of electronic component
JP2000269692A (en) 1999-03-16 2000-09-29 Matsushita Electric Ind Co Ltd Method for detecting warpage of substrate, and part- fitting method and device using the same
JP2001237596A (en) 2000-02-24 2001-08-31 Matsushita Electric Ind Co Ltd Method and device for mounting electronic part
JP7507412B2 (en) 2020-05-26 2024-06-28 パナソニックＩｐマネジメント株式会社 Component mounting device and component mounting system

Also Published As

Publication number Publication date
WO2022269668A1 (en) 2022-12-29
DE112021007857T5 (en) 2024-04-04
JP7570517B2 (en) 2024-10-21

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