JPWO2022265003A1 - - Google Patents
Info
- Publication number
- JPWO2022265003A1 JPWO2022265003A1 JP2023530337A JP2023530337A JPWO2022265003A1 JP WO2022265003 A1 JPWO2022265003 A1 JP WO2022265003A1 JP 2023530337 A JP2023530337 A JP 2023530337A JP 2023530337 A JP2023530337 A JP 2023530337A JP WO2022265003 A1 JPWO2022265003 A1 JP WO2022265003A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021101541 | 2021-06-18 | ||
| PCT/JP2022/023763 WO2022265003A1 (ja) | 2021-06-18 | 2022-06-14 | パワー半導体装置およびその製造方法ならびに電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022265003A1 true JPWO2022265003A1 (ja) | 2022-12-22 |
| JPWO2022265003A5 JPWO2022265003A5 (ja) | 2024-02-26 |
Family
ID=84526495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023530337A Pending JPWO2022265003A1 (ja) | 2021-06-18 | 2022-06-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022265003A1 (ja) |
| CN (1) | CN117501436A (ja) |
| WO (1) | WO2022265003A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7479580B1 (ja) | 2023-07-27 | 2024-05-08 | 三菱電機株式会社 | 電力半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5831273B2 (ja) * | 2012-02-09 | 2015-12-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| DE112017005953T5 (de) * | 2016-11-24 | 2019-08-29 | Mitsubishi Electric Corporation | Halbleiterbauelement und verfahren zur herstellung des halbleiterbauelements |
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2022
- 2022-06-14 CN CN202280041736.6A patent/CN117501436A/zh active Pending
- 2022-06-14 WO PCT/JP2022/023763 patent/WO2022265003A1/ja active Application Filing
- 2022-06-14 JP JP2023530337A patent/JPWO2022265003A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022265003A1 (ja) | 2022-12-22 |
| CN117501436A (zh) | 2024-02-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231122 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231122 |