JPWO2022264810A1 - - Google Patents
Info
- Publication number
- JPWO2022264810A1 JPWO2022264810A1 JP2023529765A JP2023529765A JPWO2022264810A1 JP WO2022264810 A1 JPWO2022264810 A1 JP WO2022264810A1 JP 2023529765 A JP2023529765 A JP 2023529765A JP 2023529765 A JP2023529765 A JP 2023529765A JP WO2022264810 A1 JPWO2022264810 A1 JP WO2022264810A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/023080 WO2022264374A1 (en) | 2021-06-17 | 2021-06-17 | Resin sealing device and resin sealing method |
| PCT/JP2022/022265 WO2022264810A1 (en) | 2021-06-17 | 2022-06-01 | Resin sealing method and resin sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264810A1 true JPWO2022264810A1 (en) | 2022-12-22 |
Family
ID=84526400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529765A Pending JPWO2022264810A1 (en) | 2021-06-17 | 2022-06-01 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022264810A1 (en) |
| TW (1) | TWI808797B (en) |
| WO (2) | WO2022264374A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59184970U (en) * | 1983-05-30 | 1984-12-08 | 富士通株式会社 | Exterior resin immersion tank |
| JP5153509B2 (en) * | 2008-08-08 | 2013-02-27 | Ｔｏｗａ株式会社 | Electronic component compression molding method and mold apparatus |
| JP2010162710A (en) * | 2009-01-13 | 2010-07-29 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| KR101950894B1 (en) * | 2011-11-08 | 2019-04-22 | 아피쿠 야마다 가부시키가이샤 | Resin molding apparatus |
| JP6672103B2 (en) * | 2016-08-01 | 2020-03-25 | Ｔｏｗａ株式会社 | Resin molding apparatus and resin molded article manufacturing method |
-
2021
- 2021-06-17 WO PCT/JP2021/023080 patent/WO2022264374A1/en active Application Filing
-
2022
- 2022-06-01 JP JP2023529765A patent/JPWO2022264810A1/ja active Pending
- 2022-06-01 WO PCT/JP2022/022265 patent/WO2022264810A1/en active Application Filing
- 2022-06-16 TW TW111122467A patent/TWI808797B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI808797B (en) | 2023-07-11 |
| WO2022264374A1 (en) | 2022-12-22 |
| TW202302313A (en) | 2023-01-16 |
| WO2022264810A1 (en) | 2022-12-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230621 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240514 |