JPWO2022264546A1 - - Google Patents
Info
- Publication number
- JPWO2022264546A1 JPWO2022264546A1 JP2023529533A JP2023529533A JPWO2022264546A1 JP WO2022264546 A1 JPWO2022264546 A1 JP WO2022264546A1 JP 2023529533 A JP2023529533 A JP 2023529533A JP 2023529533 A JP2023529533 A JP 2023529533A JP WO2022264546 A1 JPWO2022264546 A1 JP WO2022264546A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021100176 | 2021-06-16 | ||
| PCT/JP2022/009950 WO2022264546A1 (en) | 2021-06-16 | 2022-03-08 | Electroconductive sheet and dicing/die bonding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264546A1 true JPWO2022264546A1 (en) | 2022-12-22 |
Family
ID=84526072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529533A Pending JPWO2022264546A1 (en) | 2021-06-16 | 2022-03-08 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022264546A1 (en) |
| CN (1) | CN117321744A (en) |
| TW (1) | TW202300605A (en) |
| WO (1) | WO2022264546A1 (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4785095B2 (en) * | 2009-08-25 | 2011-10-05 | 古河電気工業株式会社 | Wafer processing tape |
| JP2012079936A (en) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | Dicing, die-bonding film and method for manufacturing semiconductor device |
| KR101787926B1 (en) * | 2013-10-15 | 2017-10-18 | 미쓰비시덴키 가부시키가이샤 | Semiconductor-element manufacturing method and wafer mounting device |
| JP6073263B2 (en) * | 2014-03-31 | 2017-02-01 | 日東電工株式会社 | Die bond film with dicing sheet and method for manufacturing semiconductor device |
| JP5908543B2 (en) * | 2014-08-07 | 2016-04-26 | 日東電工株式会社 | Manufacturing method of semiconductor device |
| JP6396189B2 (en) * | 2014-11-27 | 2018-09-26 | 日東電工株式会社 | Conductive film adhesive, dicing tape with film adhesive, and method for manufacturing semiconductor device |
| JP2016125043A (en) * | 2015-01-08 | 2016-07-11 | 積水化学工業株式会社 | Adhesive film for semiconductor wafer |
| JP2017045935A (en) * | 2015-08-28 | 2017-03-02 | 日立化成株式会社 | Manufacturing method for semiconductor device using adhesive sheet and dicing tape |
| WO2018179796A1 (en) * | 2017-03-29 | 2018-10-04 | 日東電工株式会社 | Thermal-bonding sheet and thermal-bonding sheet-attached dicing tape |
| CN111344813B (en) * | 2017-11-13 | 2023-02-28 | 日东电工株式会社 | Composition for sinter bonding, sheet for sinter bonding, and dicing tape with sheet for sinter bonding |
| JP7046585B2 (en) * | 2017-12-14 | 2022-04-04 | 日東電工株式会社 | Adhesive film and adhesive film with dicing tape |
| KR20210141490A (en) * | 2019-03-15 | 2021-11-23 | 린텍 가부시키가이샤 | Manufacturing method of film-form baking material with a support sheet, a roll body, a laminated body, and an apparatus |
| JP7190418B2 (en) * | 2019-11-08 | 2022-12-15 | 日東電工株式会社 | Thermosetting sheet and dicing die bond film |
-
2022
- 2022-03-08 JP JP2023529533A patent/JPWO2022264546A1/ja active Pending
- 2022-03-08 CN CN202280035889.XA patent/CN117321744A/en active Pending
- 2022-03-08 WO PCT/JP2022/009950 patent/WO2022264546A1/en active Application Filing
- 2022-04-12 TW TW111113808A patent/TW202300605A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN117321744A (en) | 2023-12-29 |
| TW202300605A (en) | 2023-01-01 |
| WO2022264546A1 (en) | 2022-12-22 |