JPWO2022264195A1 - - Google Patents

Info

Publication number
JPWO2022264195A1
JPWO2022264195A1 JP2022543505A JP2022543505A JPWO2022264195A1 JP WO2022264195 A1 JPWO2022264195 A1 JP WO2022264195A1 JP 2022543505 A JP2022543505 A JP 2022543505A JP 2022543505 A JP2022543505 A JP 2022543505A JP WO2022264195 A1 JPWO2022264195 A1 JP WO2022264195A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022543505A
Other versions
JP7474336B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022264195A1 publication Critical patent/JPWO2022264195A1/ja
Application granted granted Critical
Publication of JP7474336B2 publication Critical patent/JP7474336B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Evolutionary Computation (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • Image Analysis (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
JP2022543505A 2021-06-14 2021-06-14 コンピュータシステム、寸法計測方法、および記憶媒体 Active JP7474336B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/022456 WO2022264195A1 (ja) 2021-06-14 2021-06-14 コンピュータシステム、寸法計測方法、および記憶媒体

Publications (2)

Publication Number Publication Date
JPWO2022264195A1 true JPWO2022264195A1 (ja) 2022-12-22
JP7474336B2 JP7474336B2 (ja) 2024-04-24

Family

ID=84525773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022543505A Active JP7474336B2 (ja) 2021-06-14 2021-06-14 コンピュータシステム、寸法計測方法、および記憶媒体

Country Status (6)

Country Link
US (1) US20240200939A1 (ja)
JP (1) JP7474336B2 (ja)
KR (1) KR20220169005A (ja)
CN (1) CN115943288A (ja)
TW (1) TWI844033B (ja)
WO (1) WO2022264195A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12106531B2 (en) * 2021-07-22 2024-10-01 Microsoft Technology Licensing, Llc Focused computer detection of objects in images

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014052256A (ja) * 2012-09-06 2014-03-20 Nikon Corp 画像測定用プログラム、画像測定機、及び画像測定方法
WO2020121564A1 (ja) * 2019-07-04 2020-06-18 株式会社日立ハイテク 寸法計測装置、寸法計測プログラム及び半導体製造システム
WO2021002025A1 (ja) * 2019-07-04 2021-01-07 富士通株式会社 骨格認識方法、骨格認識プログラム、骨格認識システム、学習方法、学習プログラムおよび学習装置
JP2021022250A (ja) * 2019-07-29 2021-02-18 京セラ株式会社 画像処理システム、機械学習器、撮像装置及び学習方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865147B2 (ja) 2001-05-29 2012-02-01 エスアイアイ・ナノテクノロジー株式会社 ディスプレイ顕微鏡画像を用いたパターン測定方法及び測定システム
JP5549502B2 (ja) 2010-09-24 2014-07-16 凸版印刷株式会社 パターン画像測定方法及びパターン画像測定装置
US9489743B2 (en) * 2013-03-13 2016-11-08 Mecommerce, Inc. Determining dimension of target object in an image using reference object

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014052256A (ja) * 2012-09-06 2014-03-20 Nikon Corp 画像測定用プログラム、画像測定機、及び画像測定方法
WO2020121564A1 (ja) * 2019-07-04 2020-06-18 株式会社日立ハイテク 寸法計測装置、寸法計測プログラム及び半導体製造システム
WO2021002025A1 (ja) * 2019-07-04 2021-01-07 富士通株式会社 骨格認識方法、骨格認識プログラム、骨格認識システム、学習方法、学習プログラムおよび学習装置
JP2021022250A (ja) * 2019-07-29 2021-02-18 京セラ株式会社 画像処理システム、機械学習器、撮像装置及び学習方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
原田達也, 機械学習プロフェッショナルシリーズ 画像認識, JPN7023002757, 24 May 2017 (2017-05-24), JP, pages 20 - 25, ISSN: 0005114760 *

Also Published As

Publication number Publication date
KR20220169005A (ko) 2022-12-26
JP7474336B2 (ja) 2024-04-24
WO2022264195A1 (ja) 2022-12-22
CN115943288A (zh) 2023-04-07
TW202248596A (zh) 2022-12-16
US20240200939A1 (en) 2024-06-20
TWI844033B (zh) 2024-06-01

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR112021014123A2 (ja)
BR112022009896A2 (ja)
BR112023009656A2 (ja)
BR112022024743A2 (ja)
BR112023006729A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
JPWO2022264195A1 (ja)
BR102021007058A2 (ja)
BR112023008622A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220715

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230725

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230921

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240305

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240319

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240412

R150 Certificate of patent or registration of utility model

Ref document number: 7474336

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150