JPWO2022255136A1 - - Google Patents

Info

Publication number
JPWO2022255136A1
JPWO2022255136A1 JP2023525732A JP2023525732A JPWO2022255136A1 JP WO2022255136 A1 JPWO2022255136 A1 JP WO2022255136A1 JP 2023525732 A JP2023525732 A JP 2023525732A JP 2023525732 A JP2023525732 A JP 2023525732A JP WO2022255136 A1 JPWO2022255136 A1 JP WO2022255136A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023525732A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022255136A1 publication Critical patent/JPWO2022255136A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02Homopolymers or copolymers of hydrocarbons
    • C09J125/04Homopolymers or copolymers of styrene
    • C09J125/08Copolymers of styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023525732A 2021-06-02 2022-05-23 Pending JPWO2022255136A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021092816 2021-06-02
PCT/JP2022/021044 WO2022255136A1 (ja) 2021-06-02 2022-05-23 接着剤組成物

Publications (1)

Publication Number Publication Date
JPWO2022255136A1 true JPWO2022255136A1 (https=) 2022-12-08

Family

ID=84323277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525732A Pending JPWO2022255136A1 (https=) 2021-06-02 2022-05-23

Country Status (2)

Country Link
JP (1) JPWO2022255136A1 (https=)
WO (1) WO2022255136A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024143120A1 (https=) * 2022-12-27 2024-07-04
WO2025079399A1 (ja) * 2023-10-13 2025-04-17 コニカミノルタ株式会社 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置
CN120137593B (zh) * 2025-04-08 2026-02-06 北京林业大学 一种基于双动态共价键增强增韧生物基胶黏剂的制备方法及应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014080478A (ja) * 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 印刷配線板用樹脂組成物、並びに印刷配線板用樹脂フィルム及びその製造方法
JP2017163131A (ja) * 2016-03-08 2017-09-14 東洋インキScホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP2020015859A (ja) * 2018-07-26 2020-01-30 味の素株式会社 樹脂組成物
WO2020090634A1 (ja) * 2018-10-31 2020-05-07 三井化学株式会社 ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6332458B2 (ja) * 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP7736567B2 (ja) * 2019-12-23 2025-09-09 信越ポリマー株式会社 接着剤組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014080478A (ja) * 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 印刷配線板用樹脂組成物、並びに印刷配線板用樹脂フィルム及びその製造方法
JP2017163131A (ja) * 2016-03-08 2017-09-14 東洋インキScホールディングス株式会社 積層体およびその製造方法、並びに接着層付樹脂フィルム
JP2020015859A (ja) * 2018-07-26 2020-01-30 味の素株式会社 樹脂組成物
WO2020090634A1 (ja) * 2018-10-31 2020-05-07 三井化学株式会社 ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス

Also Published As

Publication number Publication date
WO2022255136A1 (ja) 2022-12-08

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