JPWO2022255136A1 - - Google Patents
Info
- Publication number
- JPWO2022255136A1 JPWO2022255136A1 JP2023525732A JP2023525732A JPWO2022255136A1 JP WO2022255136 A1 JPWO2022255136 A1 JP WO2022255136A1 JP 2023525732 A JP2023525732 A JP 2023525732A JP 2023525732 A JP2023525732 A JP 2023525732A JP WO2022255136 A1 JPWO2022255136 A1 JP WO2022255136A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021092816 | 2021-06-02 | ||
| PCT/JP2022/021044 WO2022255136A1 (ja) | 2021-06-02 | 2022-05-23 | 接着剤組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022255136A1 true JPWO2022255136A1 (https=) | 2022-12-08 |
Family
ID=84323277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023525732A Pending JPWO2022255136A1 (https=) | 2021-06-02 | 2022-05-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022255136A1 (https=) |
| WO (1) | WO2022255136A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024143120A1 (https=) * | 2022-12-27 | 2024-07-04 | ||
| WO2025079399A1 (ja) * | 2023-10-13 | 2025-04-17 | コニカミノルタ株式会社 | 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置 |
| CN120137593B (zh) * | 2025-04-08 | 2026-02-06 | 北京林业大学 | 一种基于双动态共价键增强增韧生物基胶黏剂的制备方法及应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014080478A (ja) * | 2012-10-15 | 2014-05-08 | Hitachi Chemical Co Ltd | 印刷配線板用樹脂組成物、並びに印刷配線板用樹脂フィルム及びその製造方法 |
| JP2017163131A (ja) * | 2016-03-08 | 2017-09-14 | 東洋インキScホールディングス株式会社 | 積層体およびその製造方法、並びに接着層付樹脂フィルム |
| JP2020015859A (ja) * | 2018-07-26 | 2020-01-30 | 味の素株式会社 | 樹脂組成物 |
| WO2020090634A1 (ja) * | 2018-10-31 | 2020-05-07 | 三井化学株式会社 | ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6332458B2 (ja) * | 2014-07-31 | 2018-05-30 | 東亞合成株式会社 | 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル |
| JP7736567B2 (ja) * | 2019-12-23 | 2025-09-09 | 信越ポリマー株式会社 | 接着剤組成物 |
-
2022
- 2022-05-23 WO PCT/JP2022/021044 patent/WO2022255136A1/ja not_active Ceased
- 2022-05-23 JP JP2023525732A patent/JPWO2022255136A1/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014080478A (ja) * | 2012-10-15 | 2014-05-08 | Hitachi Chemical Co Ltd | 印刷配線板用樹脂組成物、並びに印刷配線板用樹脂フィルム及びその製造方法 |
| JP2017163131A (ja) * | 2016-03-08 | 2017-09-14 | 東洋インキScホールディングス株式会社 | 積層体およびその製造方法、並びに接着層付樹脂フィルム |
| JP2020015859A (ja) * | 2018-07-26 | 2020-01-30 | 味の素株式会社 | 樹脂組成物 |
| WO2020090634A1 (ja) * | 2018-10-31 | 2020-05-07 | 三井化学株式会社 | ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022255136A1 (ja) | 2022-12-08 |
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