JPWO2022224553A1 - - Google Patents

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Publication number
JPWO2022224553A1
JPWO2022224553A1 JP2023516298A JP2023516298A JPWO2022224553A1 JP WO2022224553 A1 JPWO2022224553 A1 JP WO2022224553A1 JP 2023516298 A JP2023516298 A JP 2023516298A JP 2023516298 A JP2023516298 A JP 2023516298A JP WO2022224553 A1 JPWO2022224553 A1 JP WO2022224553A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023516298A
Other languages
Japanese (ja)
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JP7825183B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022224553A1 publication Critical patent/JPWO2022224553A1/ja
Application granted granted Critical
Publication of JP7825183B2 publication Critical patent/JP7825183B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Feeding Of Articles To Conveyors (AREA)
JP2023516298A 2021-04-20 2022-02-09 部品供給装置 Active JP7825183B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021071125 2021-04-20
JP2021071125 2021-04-20
PCT/JP2022/005076 WO2022224553A1 (ja) 2021-04-20 2022-02-09 部品供給装置、部品実装装置、および、部品供給方法

Publications (2)

Publication Number Publication Date
JPWO2022224553A1 true JPWO2022224553A1 (https=) 2022-10-27
JP7825183B2 JP7825183B2 (ja) 2026-03-06

Family

ID=83722766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516298A Active JP7825183B2 (ja) 2021-04-20 2022-02-09 部品供給装置

Country Status (2)

Country Link
JP (1) JP7825183B2 (https=)
WO (1) WO2022224553A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025203569A1 (ja) * 2024-03-29 2025-10-02 株式会社Fuji バルクフィーダ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155124U (https=) * 1981-03-24 1982-09-29
JP2006088266A (ja) * 2004-09-24 2006-04-06 Ckd Corp 非接触吸着装置
JP2010280473A (ja) * 2009-06-04 2010-12-16 Ntn Corp 振動式部品供給装置
JP2011114084A (ja) * 2009-11-25 2011-06-09 Nitto Kogyo Co Ltd 電子部品供給装置
JP2011178560A (ja) * 2010-02-04 2011-09-15 Eiko Sangyo Kk チップ部品の整列供給装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155124U (https=) * 1981-03-24 1982-09-29
JP2006088266A (ja) * 2004-09-24 2006-04-06 Ckd Corp 非接触吸着装置
JP2010280473A (ja) * 2009-06-04 2010-12-16 Ntn Corp 振動式部品供給装置
JP2011114084A (ja) * 2009-11-25 2011-06-09 Nitto Kogyo Co Ltd 電子部品供給装置
JP2011178560A (ja) * 2010-02-04 2011-09-15 Eiko Sangyo Kk チップ部品の整列供給装置

Also Published As

Publication number Publication date
WO2022224553A1 (ja) 2022-10-27
JP7825183B2 (ja) 2026-03-06

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