JPWO2022224377A1 - - Google Patents
Info
- Publication number
- JPWO2022224377A1 JPWO2022224377A1 JP2023515950A JP2023515950A JPWO2022224377A1 JP WO2022224377 A1 JPWO2022224377 A1 JP WO2022224377A1 JP 2023515950 A JP2023515950 A JP 2023515950A JP 2023515950 A JP2023515950 A JP 2023515950A JP WO2022224377 A1 JPWO2022224377 A1 JP WO2022224377A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/016181 WO2022224377A1 (ja) | 2021-04-21 | 2021-04-21 | 部品供給装置および部品実装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022224377A1 true JPWO2022224377A1 (zh) | 2022-10-27 |
| JPWO2022224377A5 JPWO2022224377A5 (zh) | 2023-10-20 |
Family
ID=83723429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023515950A Pending JPWO2022224377A1 (zh) | 2021-04-21 | 2021-04-21 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022224377A1 (zh) |
| CN (1) | CN117063624A (zh) |
| WO (1) | WO2022224377A1 (zh) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3860821B2 (ja) * | 1997-01-20 | 2006-12-20 | 松下電器産業株式会社 | 部品供給装置 |
| JP4772108B2 (ja) * | 2008-12-26 | 2011-09-14 | ヤマハ発動機株式会社 | 部品供給装置及びそれを備えた表面実装機 |
| JP5660816B2 (ja) * | 2010-07-07 | 2015-01-28 | Juki株式会社 | 電子部品供給装置 |
| US10462946B2 (en) * | 2015-03-18 | 2019-10-29 | Fuji Corporation | Component mounting machine and tape peeling recovery method for component mounting machine |
-
2021
- 2021-04-21 WO PCT/JP2021/016181 patent/WO2022224377A1/ja active Application Filing
- 2021-04-21 CN CN202180096414.7A patent/CN117063624A/zh active Pending
- 2021-04-21 JP JP2023515950A patent/JPWO2022224377A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022224377A1 (ja) | 2022-10-27 |
| CN117063624A (zh) | 2023-11-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20230621 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230621 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240827 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241009 |