JPWO2022215633A1 - - Google Patents

Info

Publication number
JPWO2022215633A1
JPWO2022215633A1 JP2023512988A JP2023512988A JPWO2022215633A1 JP WO2022215633 A1 JPWO2022215633 A1 JP WO2022215633A1 JP 2023512988 A JP2023512988 A JP 2023512988A JP 2023512988 A JP2023512988 A JP 2023512988A JP WO2022215633 A1 JPWO2022215633 A1 JP WO2022215633A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023512988A
Other languages
Japanese (ja)
Other versions
JPWO2022215633A5 (en
JP7378668B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022215633A1 publication Critical patent/JPWO2022215633A1/ja
Publication of JPWO2022215633A5 publication Critical patent/JPWO2022215633A5/ja
Application granted granted Critical
Publication of JP7378668B2 publication Critical patent/JP7378668B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
JP2023512988A 2021-04-09 2022-03-30 Electrostatic chuck and substrate processing equipment Active JP7378668B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021066278 2021-04-09
JP2021066278 2021-04-09
PCT/JP2022/016272 WO2022215633A1 (en) 2021-04-09 2022-03-30 Electrostatic chuck and substrate processing device

Publications (3)

Publication Number Publication Date
JPWO2022215633A1 true JPWO2022215633A1 (en) 2022-10-13
JPWO2022215633A5 JPWO2022215633A5 (en) 2023-09-22
JP7378668B2 JP7378668B2 (en) 2023-11-13

Family

ID=83546080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023512988A Active JP7378668B2 (en) 2021-04-09 2022-03-30 Electrostatic chuck and substrate processing equipment

Country Status (4)

Country Link
JP (1) JP7378668B2 (en)
KR (1) KR20230169071A (en)
TW (1) TW202306020A (en)
WO (1) WO2022215633A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251854A (en) * 2007-03-30 2008-10-16 Tokyo Electron Ltd Plasma processor
JP2013042145A (en) * 2012-09-03 2013-02-28 Tokyo Electron Ltd Plasma processing apparatus
JP2015062237A (en) * 2014-10-29 2015-04-02 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2016184645A (en) * 2015-03-26 2016-10-20 住友大阪セメント株式会社 Electrostatic chuck device
WO2019163757A1 (en) * 2018-02-20 2019-08-29 住友大阪セメント株式会社 Electrostatic chuck device and method for producing electrostatic chuck device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251854A (en) * 2007-03-30 2008-10-16 Tokyo Electron Ltd Plasma processor
JP2013042145A (en) * 2012-09-03 2013-02-28 Tokyo Electron Ltd Plasma processing apparatus
JP2015062237A (en) * 2014-10-29 2015-04-02 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2016184645A (en) * 2015-03-26 2016-10-20 住友大阪セメント株式会社 Electrostatic chuck device
WO2019163757A1 (en) * 2018-02-20 2019-08-29 住友大阪セメント株式会社 Electrostatic chuck device and method for producing electrostatic chuck device

Also Published As

Publication number Publication date
WO2022215633A1 (en) 2022-10-13
KR20230169071A (en) 2023-12-15
TW202306020A (en) 2023-02-01
JP7378668B2 (en) 2023-11-13

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