JPWO2022215528A1 - - Google Patents
Info
- Publication number
- JPWO2022215528A1 JPWO2022215528A1 JP2023512926A JP2023512926A JPWO2022215528A1 JP WO2022215528 A1 JPWO2022215528 A1 JP WO2022215528A1 JP 2023512926 A JP2023512926 A JP 2023512926A JP 2023512926 A JP2023512926 A JP 2023512926A JP WO2022215528 A1 JPWO2022215528 A1 JP WO2022215528A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021064209 | 2021-04-05 | ||
PCT/JP2022/013628 WO2022215528A1 (en) | 2021-04-05 | 2022-03-23 | Resin composition and elastomer material comprising said resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022215528A1 true JPWO2022215528A1 (en) | 2022-10-13 |
Family
ID=83545378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023512926A Pending JPWO2022215528A1 (en) | 2021-04-05 | 2022-03-23 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022215528A1 (en) |
WO (1) | WO2022215528A1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602006021155D1 (en) * | 2005-02-03 | 2011-05-19 | Asahi Kasei Chemicals Corp | RESIN COMPOSITION FOR ELECTRONIC AND ELECTRICAL COMPONENTS OF HIGH FREQUENCY APPLICATIONS AND SHAPED PRODUCT THEREOF |
KR100979723B1 (en) * | 2008-05-02 | 2010-09-07 | 엘지이노텍 주식회사 | Anisotropic conductive film having a optimum elastic restitution property and circuit board using the same |
CN108659237B (en) * | 2018-05-22 | 2021-01-26 | 中南林业科技大学 | Nanofiber composite hydrogel with conductivity tuned with temperature as well as preparation method and application thereof |
CN110776847B (en) * | 2018-07-27 | 2021-11-12 | 嘉兴蓉阳电子科技有限公司 | Conductive adhesive, raw material composition, electronic element, preparation method and application |
JP7373322B2 (en) * | 2019-08-29 | 2023-11-02 | Eneos株式会社 | Elastomer composition for actuator, actuator member, and actuator element |
CN110938894B (en) * | 2019-11-05 | 2021-06-11 | 东华大学 | Anti-freezing self-repairing conductive nano composite hydrogel fiber and preparation method thereof |
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2022
- 2022-03-23 WO PCT/JP2022/013628 patent/WO2022215528A1/en active Application Filing
- 2022-03-23 JP JP2023512926A patent/JPWO2022215528A1/ja active Pending
Also Published As
Publication number | Publication date |
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WO2022215528A1 (en) | 2022-10-13 |