JPWO2022211113A1 - - Google Patents

Info

Publication number
JPWO2022211113A1
JPWO2022211113A1 JP2023511755A JP2023511755A JPWO2022211113A1 JP WO2022211113 A1 JPWO2022211113 A1 JP WO2022211113A1 JP 2023511755 A JP2023511755 A JP 2023511755A JP 2023511755 A JP2023511755 A JP 2023511755A JP WO2022211113 A1 JPWO2022211113 A1 JP WO2022211113A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511755A
Other versions
JP7488960B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022211113A1 publication Critical patent/JPWO2022211113A1/ja
Application granted granted Critical
Publication of JP7488960B2 publication Critical patent/JP7488960B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2023511755A 2021-03-31 2022-03-31 光照射装置 Active JP7488960B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021062300 2021-03-31
JP2021062300 2021-03-31
PCT/JP2022/016950 WO2022211113A1 (ja) 2021-03-31 2022-03-31 光照射装置

Publications (2)

Publication Number Publication Date
JPWO2022211113A1 true JPWO2022211113A1 (ja) 2022-10-06
JP7488960B2 JP7488960B2 (ja) 2024-05-22

Family

ID=83459185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511755A Active JP7488960B2 (ja) 2021-03-31 2022-03-31 光照射装置

Country Status (2)

Country Link
JP (1) JP7488960B2 (ja)
WO (1) WO2022211113A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4442304B2 (ja) 2004-04-30 2010-03-31 ソニー株式会社 発光ユニットの放熱装置及びバックライト装置
KR100671545B1 (ko) 2005-07-01 2007-01-19 삼성전자주식회사 Ｌｅｄ 어레이 모듈
TWI417604B (zh) * 2005-12-28 2013-12-01 Semiconductor Energy Lab 顯示裝置
JP2008300158A (ja) 2007-05-31 2008-12-11 Sohki:Kk 光源基板、光源装置および光源冷却システム
JP2009010050A (ja) * 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 光源装置
JP2009010047A (ja) * 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 発光ダイオードを用いた光源
JP2011165509A (ja) 2010-02-10 2011-08-25 Moritex Corp Ｌｅｄ照明装置

Also Published As

Publication number Publication date
JP7488960B2 (ja) 2024-05-22
WO2022211113A1 (ja) 2022-10-06

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