JPWO2022211023A1 - - Google Patents

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Publication number
JPWO2022211023A1
JPWO2022211023A1 JP2023511705A JP2023511705A JPWO2022211023A1 JP WO2022211023 A1 JPWO2022211023 A1 JP WO2022211023A1 JP 2023511705 A JP2023511705 A JP 2023511705A JP 2023511705 A JP2023511705 A JP 2023511705A JP WO2022211023 A1 JPWO2022211023 A1 JP WO2022211023A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511705A
Other languages
Japanese (ja)
Other versions
JPWO2022211023A5 (https=
JP7742401B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022211023A1 publication Critical patent/JPWO2022211023A1/ja
Publication of JPWO2022211023A5 publication Critical patent/JPWO2022211023A5/ja
Application granted granted Critical
Publication of JP7742401B2 publication Critical patent/JP7742401B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • F16C29/025—Hydrostatic or aerostatic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2380/00—Electrical apparatus
    • F16C2380/18—Handling tools for semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Liquid Crystal (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
JP2023511705A 2021-04-01 2022-03-31 ステージ装置、露光装置、検査装置およびデバイス製造方法 Active JP7742401B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021062640 2021-04-01
JP2021062640 2021-04-01
PCT/JP2022/016511 WO2022211023A1 (ja) 2021-04-01 2022-03-31 ステージ装置、露光装置、検査装置およびデバイス製造方法

Publications (3)

Publication Number Publication Date
JPWO2022211023A1 true JPWO2022211023A1 (https=) 2022-10-06
JPWO2022211023A5 JPWO2022211023A5 (https=) 2024-01-16
JP7742401B2 JP7742401B2 (ja) 2025-09-19

Family

ID=83456622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511705A Active JP7742401B2 (ja) 2021-04-01 2022-03-31 ステージ装置、露光装置、検査装置およびデバイス製造方法

Country Status (7)

Country Link
US (1) US20240021463A1 (https=)
EP (1) EP4317722A4 (https=)
JP (1) JP7742401B2 (https=)
KR (1) KR20230164074A (https=)
CN (1) CN117157743A (https=)
TW (1) TWI806474B (https=)
WO (1) WO2022211023A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134501A1 (ja) * 2023-12-21 2025-06-26 住友重機械工業株式会社 駆動装置、位置決め装置、処理装置、デバイス製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005050944A (ja) * 2003-07-31 2005-02-24 Nikon Corp 露光装置
JP2005079367A (ja) * 2003-09-01 2005-03-24 Nikon Corp ステージ装置及び露光装置
JP2005203567A (ja) * 2004-01-15 2005-07-28 Canon Inc 駆動装置、露光装置及びデバイス製造方法
JP2018062993A (ja) * 2016-10-13 2018-04-19 住友重機械工業株式会社 ステージ装置
JP2018170412A (ja) * 2017-03-30 2018-11-01 ピー・ヂー・ダブリュー株式会社 スライダ装置およびその製造方法
WO2020044685A1 (ja) * 2018-08-30 2020-03-05 住友重機械工業株式会社 ステージ装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557558A (ja) 1991-08-29 1993-03-09 Matsushita Electric Ind Co Ltd 移動案内装置
JP2004260116A (ja) * 2003-02-27 2004-09-16 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法
CN101241314B (zh) * 2008-03-11 2010-06-23 上海微电子装备有限公司 可补偿z向位置的六自由度精密定位台
JP5863149B2 (ja) * 2012-04-04 2016-02-16 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN110658688B (zh) * 2018-06-29 2020-12-15 上海微电子装备（集团）股份有限公司 一种工件台系统及光刻设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005050944A (ja) * 2003-07-31 2005-02-24 Nikon Corp 露光装置
JP2005079367A (ja) * 2003-09-01 2005-03-24 Nikon Corp ステージ装置及び露光装置
JP2005203567A (ja) * 2004-01-15 2005-07-28 Canon Inc 駆動装置、露光装置及びデバイス製造方法
JP2018062993A (ja) * 2016-10-13 2018-04-19 住友重機械工業株式会社 ステージ装置
JP2018170412A (ja) * 2017-03-30 2018-11-01 ピー・ヂー・ダブリュー株式会社 スライダ装置およびその製造方法
WO2020044685A1 (ja) * 2018-08-30 2020-03-05 住友重機械工業株式会社 ステージ装置

Also Published As

Publication number Publication date
EP4317722A1 (en) 2024-02-07
EP4317722A4 (en) 2024-10-16
KR20230164074A (ko) 2023-12-01
JP7742401B2 (ja) 2025-09-19
CN117157743A (zh) 2023-12-01
TW202240317A (zh) 2022-10-16
US20240021463A1 (en) 2024-01-18
WO2022211023A1 (ja) 2022-10-06
TWI806474B (zh) 2023-06-21

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