JPWO2022210616A1 - - Google Patents
Info
- Publication number
- JPWO2022210616A1 JPWO2022210616A1 JP2023511314A JP2023511314A JPWO2022210616A1 JP WO2022210616 A1 JPWO2022210616 A1 JP WO2022210616A1 JP 2023511314 A JP2023511314 A JP 2023511314A JP 2023511314 A JP2023511314 A JP 2023511314A JP WO2022210616 A1 JPWO2022210616 A1 JP WO2022210616A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021062118 | 2021-03-31 | ||
| PCT/JP2022/015218 WO2022210616A1 (en) | 2021-03-31 | 2022-03-28 | Semiconductor device and semiconductor system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210616A1 true JPWO2022210616A1 (en) | 2022-10-06 |
Family
ID=83459297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511314A Pending JPWO2022210616A1 (en) | 2021-03-31 | 2022-03-28 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022210616A1 (en) |
| WO (1) | WO2022210616A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3841007B2 (en) * | 2002-03-28 | 2006-11-01 | 株式会社デンソー | Semiconductor device |
| JP5203032B2 (en) * | 2008-04-28 | 2013-06-05 | 本田技研工業株式会社 | Pressure contact type semiconductor device |
| US11335642B2 (en) * | 2017-12-29 | 2022-05-17 | Intel Corporation | Microelectronic assemblies |
| KR102048478B1 (en) * | 2018-03-20 | 2019-11-25 | 엘지전자 주식회사 | Power module of double-faced cooling and method for manufacturing thereof |
-
2022
- 2022-03-28 WO PCT/JP2022/015218 patent/WO2022210616A1/en active Application Filing
- 2022-03-28 JP JP2023511314A patent/JPWO2022210616A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022210616A1 (en) | 2022-10-06 |