JPWO2022210520A1 - - Google Patents
Info
- Publication number
- JPWO2022210520A1 JPWO2022210520A1 JP2023511249A JP2023511249A JPWO2022210520A1 JP WO2022210520 A1 JPWO2022210520 A1 JP WO2022210520A1 JP 2023511249 A JP2023511249 A JP 2023511249A JP 2023511249 A JP2023511249 A JP 2023511249A JP WO2022210520 A1 JPWO2022210520 A1 JP WO2022210520A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021060510 | 2021-03-31 | ||
| PCT/JP2022/014944 WO2022210520A1 (en) | 2021-03-31 | 2022-03-28 | Aluminum nitride sintered body, method for producing same, circuit board, and multilayer substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210520A1 true JPWO2022210520A1 (en) | 2022-10-06 |
Family
ID=83456338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511249A Pending JPWO2022210520A1 (en) | 2021-03-31 | 2022-03-28 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022210520A1 (en) |
| WO (1) | WO2022210520A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0524930A (en) * | 1991-07-16 | 1993-02-02 | Showa Denko Kk | Aln sintered compact and production thereof |
| JP3183930B2 (en) * | 1992-02-17 | 2001-07-09 | イビデン株式会社 | Manufacturing method of aluminum nitride substrate |
| JP2001002474A (en) * | 1999-06-17 | 2001-01-09 | Denki Kagaku Kogyo Kk | Aluminum nitride sintered body and its production and use |
| JP3998252B2 (en) * | 2003-09-02 | 2007-10-24 | 電気化学工業株式会社 | Method for producing aluminum nitride sintered body |
| JP2011111341A (en) * | 2009-11-25 | 2011-06-09 | Panasonic Electric Works Co Ltd | Aluminum nitride substrate having oxidized layer, method for producing the substrate, circuit board obtained by using the substrate, and led module |
| JP5050070B2 (en) * | 2010-03-23 | 2012-10-17 | 株式会社東芝 | Ceramic copper circuit board and semiconductor device |
| JP6373933B2 (en) * | 2016-11-02 | 2018-08-15 | 株式会社Maruwa | Aluminum nitride sintered body and manufacturing method thereof |
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2022
- 2022-03-28 WO PCT/JP2022/014944 patent/WO2022210520A1/en active Application Filing
- 2022-03-28 JP JP2023511249A patent/JPWO2022210520A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022210520A1 (en) | 2022-10-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230803 |