JPWO2022209851A1 - - Google Patents
Info
- Publication number
- JPWO2022209851A1 JPWO2022209851A1 JP2023510882A JP2023510882A JPWO2022209851A1 JP WO2022209851 A1 JPWO2022209851 A1 JP WO2022209851A1 JP 2023510882 A JP2023510882 A JP 2023510882A JP 2023510882 A JP2023510882 A JP 2023510882A JP WO2022209851 A1 JPWO2022209851 A1 JP WO2022209851A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021054770 | 2021-03-29 | ||
| PCT/JP2022/011600 WO2022209851A1 (en) | 2021-03-29 | 2022-03-15 | Substrate and method for producing wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209851A1 true JPWO2022209851A1 (en) | 2022-10-06 |
Family
ID=83458974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510882A Pending JPWO2022209851A1 (en) | 2021-03-29 | 2022-03-15 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022209851A1 (en) |
| KR (1) | KR20230163408A (en) |
| CN (1) | CN117044410A (en) |
| TW (1) | TW202239288A (en) |
| WO (1) | WO2022209851A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100751994B1 (en) * | 2006-06-30 | 2007-08-28 | 삼성전기주식회사 | Copper clad laminate and manufacturing method of the same |
| KR20210100589A (en) | 2018-12-14 | 2021-08-17 | 미츠비시 가스 가가쿠 가부시키가이샤 | Method for manufacturing a package substrate for mounting semiconductor devices |
| WO2020121652A1 (en) * | 2018-12-14 | 2020-06-18 | 三菱瓦斯化学株式会社 | Method for manufacturing package substrate for mounting semiconductor element |
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2022
- 2022-03-15 JP JP2023510882A patent/JPWO2022209851A1/ja active Pending
- 2022-03-15 CN CN202280023716.6A patent/CN117044410A/en active Pending
- 2022-03-15 KR KR1020237032878A patent/KR20230163408A/en unknown
- 2022-03-15 WO PCT/JP2022/011600 patent/WO2022209851A1/en active Application Filing
- 2022-03-18 TW TW111110170A patent/TW202239288A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202239288A (en) | 2022-10-01 |
| KR20230163408A (en) | 2023-11-30 |
| CN117044410A (en) | 2023-11-10 |
| WO2022209851A1 (en) | 2022-10-06 |