JPWO2022202939A1 - - Google Patents

Info

Publication number
JPWO2022202939A1
JPWO2022202939A1 JP2022561607A JP2022561607A JPWO2022202939A1 JP WO2022202939 A1 JPWO2022202939 A1 JP WO2022202939A1 JP 2022561607 A JP2022561607 A JP 2022561607A JP 2022561607 A JP2022561607 A JP 2022561607A JP WO2022202939 A1 JPWO2022202939 A1 JP WO2022202939A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022561607A
Other languages
Japanese (ja)
Other versions
JP7295506B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202939A1 publication Critical patent/JPWO2022202939A1/ja
Application granted granted Critical
Publication of JP7295506B2 publication Critical patent/JP7295506B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022561607A 2021-03-26 2022-03-23 Curable resin composition Active JP7295506B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021054190 2021-03-26
JP2021054190 2021-03-26
PCT/JP2022/013718 WO2022202939A1 (en) 2021-03-26 2022-03-23 Curable resin composition

Publications (2)

Publication Number Publication Date
JPWO2022202939A1 true JPWO2022202939A1 (en) 2022-09-29
JP7295506B2 JP7295506B2 (en) 2023-06-21

Family

ID=83395734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022561607A Active JP7295506B2 (en) 2021-03-26 2022-03-23 Curable resin composition

Country Status (5)

Country Link
JP (1) JP7295506B2 (en)
KR (1) KR20230156726A (en)
CN (1) CN117120553A (en)
TW (1) TW202239616A (en)
WO (1) WO2022202939A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024075717A1 (en) * 2022-10-07 2024-04-11 太陽ホールディングス株式会社 Curable resin composition, dry film, cured product, and printed wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020022393A1 (en) * 2018-07-25 2020-01-30 味の素株式会社 Magnetic paste
WO2020189778A1 (en) * 2019-03-20 2020-09-24 味の素株式会社 Resin composition
JP2021161211A (en) * 2020-03-31 2021-10-11 太陽インキ製造株式会社 Liquid thermosetting resin composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203463A (en) 2000-01-21 2001-07-27 Taiyo Ink Mfg Ltd Conductive paste for interlayer connection and as multilayer printed wiring board using the same, and its manufacturing method
US7096555B2 (en) 2003-09-19 2006-08-29 Viasystems Group, Inc. Closed loop backdrilling system
JP2017017175A (en) 2015-07-01 2017-01-19 日本電気株式会社 Multilayer wiring board, high-frequency circuit, communication device, and method of manufacturing multilayer wiring board
CN106024359B (en) * 2016-06-29 2018-07-03 深圳顺络电子股份有限公司 A kind of production method for being molded inductance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020022393A1 (en) * 2018-07-25 2020-01-30 味の素株式会社 Magnetic paste
WO2020189778A1 (en) * 2019-03-20 2020-09-24 味の素株式会社 Resin composition
JP2021161211A (en) * 2020-03-31 2021-10-11 太陽インキ製造株式会社 Liquid thermosetting resin composition

Also Published As

Publication number Publication date
JP7295506B2 (en) 2023-06-21
WO2022202939A1 (en) 2022-09-29
TW202239616A (en) 2022-10-16
CN117120553A (en) 2023-11-24
KR20230156726A (en) 2023-11-14

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