JPWO2022202592A1 - - Google Patents

Info

Publication number
JPWO2022202592A1
JPWO2022202592A1 JP2023509095A JP2023509095A JPWO2022202592A1 JP WO2022202592 A1 JPWO2022202592 A1 JP WO2022202592A1 JP 2023509095 A JP2023509095 A JP 2023509095A JP 2023509095 A JP2023509095 A JP 2023509095A JP WO2022202592 A1 JPWO2022202592 A1 JP WO2022202592A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509095A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202592A1 publication Critical patent/JPWO2022202592A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C01F7/021—After-treatment of oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023509095A 2021-03-26 2022-03-17 Pending JPWO2022202592A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021053524 2021-03-26
PCT/JP2022/012176 WO2022202592A1 (ja) 2021-03-26 2022-03-17 無機酸化物粉末、樹脂組成物及び圧縮成形品

Publications (1)

Publication Number Publication Date
JPWO2022202592A1 true JPWO2022202592A1 (ja) 2022-09-29

Family

ID=83397258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509095A Pending JPWO2022202592A1 (ja) 2021-03-26 2022-03-17

Country Status (3)

Country Link
JP (1) JPWO2022202592A1 (ja)
TW (1) TW202300580A (ja)
WO (1) WO2022202592A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005239892A (ja) * 2004-02-26 2005-09-08 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2008184584A (ja) * 2007-01-31 2008-08-14 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2008184585A (ja) * 2007-01-31 2008-08-14 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP5502556B2 (ja) * 2010-03-30 2014-05-28 大王製紙株式会社 シリカ複合粒子の製造方法
JP5874327B2 (ja) * 2011-11-07 2016-03-02 住友ベークライト株式会社 封止用エポキシ樹脂組成物、及び、これを用いた電子機器の製造方法
JP2018138634A (ja) * 2017-02-24 2018-09-06 三菱ケミカル株式会社 樹脂組成物および該樹脂組成物を用いた半導体装置
WO2020043312A1 (en) * 2018-08-31 2020-03-05 Wacker Chemie Ag Thermosetting silicone resin composition for reflector of led, reflector of led and semiconductor device using the same

Also Published As

Publication number Publication date
WO2022202592A1 (ja) 2022-09-29
TW202300580A (zh) 2023-01-01

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