JPWO2022202333A1 - - Google Patents

Info

Publication number
JPWO2022202333A1
JPWO2022202333A1 JP2022548392A JP2022548392A JPWO2022202333A1 JP WO2022202333 A1 JPWO2022202333 A1 JP WO2022202333A1 JP 2022548392 A JP2022548392 A JP 2022548392A JP 2022548392 A JP2022548392 A JP 2022548392A JP WO2022202333 A1 JPWO2022202333 A1 JP WO2022202333A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022548392A
Other languages
Japanese (ja)
Other versions
JP7160511B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202333A1 publication Critical patent/JPWO2022202333A1/ja
Application granted granted Critical
Publication of JP7160511B1 publication Critical patent/JP7160511B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022548392A 2021-03-23 2022-03-09 Phenolic resin mixture, curable resin composition and cured product thereof Active JP7160511B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021048212 2021-03-23
JP2021048212 2021-03-23
PCT/JP2022/010360 WO2022202333A1 (en) 2021-03-23 2022-03-09 Phenolic resin mixture, and curable resin composition and cured product thereof

Publications (2)

Publication Number Publication Date
JPWO2022202333A1 true JPWO2022202333A1 (en) 2022-09-29
JP7160511B1 JP7160511B1 (en) 2022-10-25

Family

ID=83395705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022548392A Active JP7160511B1 (en) 2021-03-23 2022-03-09 Phenolic resin mixture, curable resin composition and cured product thereof

Country Status (5)

Country Link
JP (1) JP7160511B1 (en)
KR (1) KR20230158497A (en)
CN (1) CN117043219A (en)
TW (1) TW202302693A (en)
WO (1) WO2022202333A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003041096A (en) 2001-07-31 2003-02-13 Sumitomo Bakelite Co Ltd Method for manufacturing epoxy resin molding material and semiconductor device
JP2013006328A (en) * 2011-06-23 2013-01-10 Sumitomo Bakelite Co Ltd Laminate, circuit board, and semiconductor package
JP5899498B2 (en) 2011-10-13 2016-04-06 パナソニックＩｐマネジメント株式会社 Epoxy resin composition for semiconductor encapsulation, method for producing the same, and semiconductor device
JP6120363B2 (en) * 2013-04-19 2017-04-26 日本化薬株式会社 Epoxy resin, epoxy resin composition and cured product thereof
JP2015067615A (en) * 2013-09-26 2015-04-13 日本化薬株式会社 Epoxy resin mixture, curable resin composition and its cured matter
JP2020070303A (en) * 2017-03-07 2020-05-07 日本化薬株式会社 Curable resin composition and cured product thereof

Also Published As

Publication number Publication date
KR20230158497A (en) 2023-11-20
CN117043219A (en) 2023-11-10
TW202302693A (en) 2023-01-16
JP7160511B1 (en) 2022-10-25
WO2022202333A1 (en) 2022-09-29

Similar Documents

Publication Publication Date Title
BR112023005462A2 (en)
BR112021014123A2 (en)
BR112023012656A2 (en)
BR112022024743A2 (en)
BR102021018859A2 (en)
BR112022009896A2 (en)
BR112023011738A2 (en)
JPWO2022202335A1 (en)
JPWO2022202333A1 (en)
BR112023016292A2 (en)
BR112023004146A2 (en)
BR112023011539A2 (en)
BR112023011610A2 (en)
BR112023008976A2 (en)
BR112023009656A2 (en)
BR112023006729A2 (en)
BR102021020147A2 (en)
BR102021018926A2 (en)
BR102021018167A2 (en)
BR102021017576A2 (en)
BR102021016837A2 (en)
BR102021016551A2 (en)
BR102021016375A2 (en)
BR102021016200A2 (en)
BR102021016176A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220809

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220809

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220929

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221003

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221012

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221012

R150 Certificate of patent or registration of utility model

Ref document number: 7160511

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150