JPWO2022201535A1 - - Google Patents
Info
- Publication number
- JPWO2022201535A1 JPWO2022201535A1 JP2022528058A JP2022528058A JPWO2022201535A1 JP WO2022201535 A1 JPWO2022201535 A1 JP WO2022201535A1 JP 2022528058 A JP2022528058 A JP 2022528058A JP 2022528058 A JP2022528058 A JP 2022528058A JP WO2022201535 A1 JPWO2022201535 A1 JP WO2022201535A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/013084 WO2022201535A1 (en) | 2021-03-26 | 2021-03-26 | Workpiece separation device and workpiece separation method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP7101923B1 JP7101923B1 (en) | 2022-07-15 |
JPWO2022201535A1 true JPWO2022201535A1 (en) | 2022-09-29 |
JPWO2022201535A5 JPWO2022201535A5 (en) | 2023-02-20 |
Family
ID=82446223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022528058A Active JP7101923B1 (en) | 2021-03-26 | 2021-03-26 | Work separation device and work separation method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7101923B1 (en) |
WO (1) | WO2022201535A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007237242A (en) * | 2006-03-09 | 2007-09-20 | Hitachi Via Mechanics Ltd | Laser beam machining apparatus |
JP7142312B2 (en) * | 2018-03-15 | 2022-09-27 | パナソニックIpマネジメント株式会社 | LASER PROCESSING APPARATUS AND LASER OSCILLATION CONTROL METHOD |
WO2019220666A1 (en) * | 2018-05-17 | 2019-11-21 | 信越エンジニアリング株式会社 | Workpiece separation device and workpiece separation method |
-
2021
- 2021-03-26 JP JP2022528058A patent/JP7101923B1/en active Active
- 2021-03-26 WO PCT/JP2021/013084 patent/WO2022201535A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP7101923B1 (en) | 2022-07-15 |
WO2022201535A1 (en) | 2022-09-29 |
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