JPWO2022196188A1 - - Google Patents
Info
- Publication number
- JPWO2022196188A1 JPWO2022196188A1 JP2023506864A JP2023506864A JPWO2022196188A1 JP WO2022196188 A1 JPWO2022196188 A1 JP WO2022196188A1 JP 2023506864 A JP2023506864 A JP 2023506864A JP 2023506864 A JP2023506864 A JP 2023506864A JP WO2022196188 A1 JPWO2022196188 A1 JP WO2022196188A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021041900 | 2021-03-15 | ||
PCT/JP2022/004899 WO2022196188A1 (en) | 2021-03-15 | 2022-02-08 | Imaging device, method for manufacturing imaging device, and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022196188A1 true JPWO2022196188A1 (en) | 2022-09-22 |
Family
ID=83322259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023506864A Pending JPWO2022196188A1 (en) | 2021-03-15 | 2022-02-08 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022196188A1 (en) |
WO (1) | WO2022196188A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4237966B2 (en) * | 2002-03-08 | 2009-03-11 | 浜松ホトニクス株式会社 | Detector |
JP2005191157A (en) * | 2003-12-25 | 2005-07-14 | Casio Comput Co Ltd | Semiconductor device and its manufacturing method |
JP4395775B2 (en) * | 2005-10-05 | 2010-01-13 | ソニー株式会社 | Semiconductor device and manufacturing method thereof |
JP2012204403A (en) * | 2011-03-23 | 2012-10-22 | Toshiba Corp | Solid-state imaging device and method of manufacturing the same |
TWI788430B (en) * | 2017-10-30 | 2023-01-01 | 日商索尼半導體解決方案公司 | Back-illuminated solid-state imaging device, manufacturing method of back-illuminated solid-state imaging device, imaging device, and electronic equipment |
KR102483548B1 (en) * | 2017-10-31 | 2023-01-02 | 삼성전자주식회사 | Image sensing apparatus |
JPWO2020079945A1 (en) * | 2018-10-15 | 2021-09-16 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state image sensor and electronic equipment |
TW202101744A (en) * | 2018-12-20 | 2021-01-01 | 日商索尼半導體解決方案公司 | Backside-illuminated solid-state imaging device, method for manufacturing backside-illuminated solid-state imaging device, imaging device, and electronic equipment |
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2022
- 2022-02-08 JP JP2023506864A patent/JPWO2022196188A1/ja active Pending
- 2022-02-08 WO PCT/JP2022/004899 patent/WO2022196188A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022196188A1 (en) | 2022-09-22 |