JPWO2022186361A1 - - Google Patents
Info
- Publication number
- JPWO2022186361A1 JPWO2022186361A1 JP2023503962A JP2023503962A JPWO2022186361A1 JP WO2022186361 A1 JPWO2022186361 A1 JP WO2022186361A1 JP 2023503962 A JP2023503962 A JP 2023503962A JP 2023503962 A JP2023503962 A JP 2023503962A JP WO2022186361 A1 JPWO2022186361 A1 JP WO2022186361A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021035808 | 2021-03-05 | ||
| PCT/JP2022/009257 WO2022186361A1 (en) | 2021-03-05 | 2022-03-03 | Curable resin composition and electronic component device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022186361A1 true JPWO2022186361A1 (en) | 2022-09-09 |
Family
ID=83155404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023503962A Pending JPWO2022186361A1 (en) | 2021-03-05 | 2022-03-03 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022186361A1 (en) |
| CN (1) | CN117120543A (en) |
| TW (1) | TW202246410A (en) |
| WO (1) | WO2022186361A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5470692B2 (en) * | 2006-10-02 | 2014-04-16 | 日立化成株式会社 | Epoxy resin molding material for sealing and electronic component device |
| EP1939150A1 (en) * | 2006-12-27 | 2008-07-02 | Varioptic | Sol-gel sealants for liquid-based optical devices |
| CA3017221A1 (en) * | 2014-12-10 | 2016-06-16 | Halliburton Energy Services, Inc. | Curable composition and resin for treatment of a subterranean formation |
| JP7119823B2 (en) * | 2018-09-19 | 2022-08-17 | 昭和電工マテリアルズ株式会社 | Epoxy resin composition for encapsulation and electronic component device |
| JP7484081B2 (en) * | 2018-10-18 | 2024-05-16 | 株式会社レゾナック | Curable resin composition and electronic component device |
-
2022
- 2022-03-03 JP JP2023503962A patent/JPWO2022186361A1/ja active Pending
- 2022-03-03 CN CN202280018109.0A patent/CN117120543A/en active Pending
- 2022-03-03 WO PCT/JP2022/009257 patent/WO2022186361A1/en active Application Filing
- 2022-03-04 TW TW111108042A patent/TW202246410A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202246410A (en) | 2022-12-01 |
| CN117120543A (en) | 2023-11-24 |
| WO2022186361A1 (en) | 2022-09-09 |