JPWO2022185453A1 - - Google Patents

Info

Publication number
JPWO2022185453A1
JPWO2022185453A1 JP2023503264A JP2023503264A JPWO2022185453A1 JP WO2022185453 A1 JPWO2022185453 A1 JP WO2022185453A1 JP 2023503264 A JP2023503264 A JP 2023503264A JP 2023503264 A JP2023503264 A JP 2023503264A JP WO2022185453 A1 JPWO2022185453 A1 JP WO2022185453A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023503264A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022185453A1 publication Critical patent/JPWO2022185453A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2023503264A 2021-03-03 2021-03-03 Pending JPWO2022185453A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/008215 WO2022185453A1 (ja) 2021-03-03 2021-03-03 炭化ケイ素エピタキシャル成長装置および炭化ケイ素エピタキシャル基板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022185453A1 true JPWO2022185453A1 (ja) 2022-09-09

Family

ID=83155218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503264A Pending JPWO2022185453A1 (ja) 2021-03-03 2021-03-03

Country Status (2)

Country Link
JP (1) JPWO2022185453A1 (ja)
WO (1) WO2022185453A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758041A (ja) * 1993-08-20 1995-03-03 Toshiba Ceramics Co Ltd サセプタ
JP2000164683A (ja) * 1998-12-01 2000-06-16 Sony Corp ウェーハ固定機構
US10167571B2 (en) * 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
JP6850590B2 (ja) * 2016-11-17 2021-03-31 昭和電工株式会社 搭載プレート、ウェハ支持台、及び化学気相成長装置

Also Published As

Publication number Publication date
WO2022185453A1 (ja) 2022-09-09

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230529