JPWO2022181684A1 - - Google Patents
Info
- Publication number
- JPWO2022181684A1 JPWO2022181684A1 JP2023502481A JP2023502481A JPWO2022181684A1 JP WO2022181684 A1 JPWO2022181684 A1 JP WO2022181684A1 JP 2023502481 A JP2023502481 A JP 2023502481A JP 2023502481 A JP2023502481 A JP 2023502481A JP WO2022181684 A1 JPWO2022181684 A1 JP WO2022181684A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021031019 | 2021-02-26 | ||
PCT/JP2022/007582 WO2022181684A1 (ja) | 2021-02-26 | 2022-02-24 | 電子素子実装用基板、電子部品、電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022181684A1 true JPWO2022181684A1 (ja) | 2022-09-01 |
JPWO2022181684A5 JPWO2022181684A5 (ja) | 2023-11-16 |
Family
ID=83049040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023502481A Pending JPWO2022181684A1 (ja) | 2021-02-26 | 2022-02-24 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022181684A1 (ja) |
CN (1) | CN116918059A (ja) |
WO (1) | WO2022181684A1 (ja) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237551A (ja) * | 2000-02-23 | 2001-08-31 | Alps Electric Co Ltd | 電子ユニットの多層基板への取付構造 |
US9609743B2 (en) * | 2013-01-31 | 2017-03-28 | Kyocera Corporation | Electronic device mounting substrate, electronic apparatus, and imaging module |
-
2022
- 2022-02-24 JP JP2023502481A patent/JPWO2022181684A1/ja active Pending
- 2022-02-24 CN CN202280016889.5A patent/CN116918059A/zh active Pending
- 2022-02-24 WO PCT/JP2022/007582 patent/WO2022181684A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022181684A1 (ja) | 2022-09-01 |
CN116918059A (zh) | 2023-10-20 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230825 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230825 |