JPWO2022181555A1 - - Google Patents
Info
- Publication number
- JPWO2022181555A1 JPWO2022181555A1 JP2023502401A JP2023502401A JPWO2022181555A1 JP WO2022181555 A1 JPWO2022181555 A1 JP WO2022181555A1 JP 2023502401 A JP2023502401 A JP 2023502401A JP 2023502401 A JP2023502401 A JP 2023502401A JP WO2022181555 A1 JPWO2022181555 A1 JP WO2022181555A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/029—Feeding axial lead components, e.g. using vibrating bowls, magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Feeding Of Articles To Conveyors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021030243 | 2021-02-26 | ||
JP2021030243 | 2021-02-26 | ||
PCT/JP2022/007007 WO2022181555A1 (ja) | 2021-02-26 | 2022-02-21 | ケース |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022181555A1 true JPWO2022181555A1 (ja) | 2022-09-01 |
JP7477042B2 JP7477042B2 (ja) | 2024-05-01 |
Family
ID=83047986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023502401A Active JP7477042B2 (ja) | 2021-02-26 | 2022-02-21 | ケース |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230389246A1 (ja) |
JP (1) | JP7477042B2 (ja) |
KR (1) | KR20230131918A (ja) |
CN (1) | CN116848962A (ja) |
WO (1) | WO2022181555A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6041964A (en) * | 1997-10-02 | 2000-03-28 | Universal Instruments Corporation | Method and apparatus for supplying components |
JP2008060190A (ja) * | 2006-08-30 | 2008-03-13 | Nitto Kogyo Co Ltd | チップ供給アタッチメント |
JP2009295618A (ja) * | 2008-06-02 | 2009-12-17 | Taiyo Yuden Co Ltd | バルクフィーダ用の部品補充システム |
JP2011114084A (ja) * | 2009-11-25 | 2011-06-09 | Nitto Kogyo Co Ltd | 電子部品供給装置 |
WO2013042544A1 (ja) * | 2011-09-21 | 2013-03-28 | 富士機械製造株式会社 | 電子回路部品装着機 |
-
2022
- 2022-02-21 CN CN202280013816.0A patent/CN116848962A/zh active Pending
- 2022-02-21 WO PCT/JP2022/007007 patent/WO2022181555A1/ja active Application Filing
- 2022-02-21 JP JP2023502401A patent/JP7477042B2/ja active Active
- 2022-02-21 KR KR1020237027682A patent/KR20230131918A/ko not_active Application Discontinuation
-
2023
- 2023-08-09 US US18/231,857 patent/US20230389246A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6041964A (en) * | 1997-10-02 | 2000-03-28 | Universal Instruments Corporation | Method and apparatus for supplying components |
JP2008060190A (ja) * | 2006-08-30 | 2008-03-13 | Nitto Kogyo Co Ltd | チップ供給アタッチメント |
JP2009295618A (ja) * | 2008-06-02 | 2009-12-17 | Taiyo Yuden Co Ltd | バルクフィーダ用の部品補充システム |
JP2011114084A (ja) * | 2009-11-25 | 2011-06-09 | Nitto Kogyo Co Ltd | 電子部品供給装置 |
WO2013042544A1 (ja) * | 2011-09-21 | 2013-03-28 | 富士機械製造株式会社 | 電子回路部品装着機 |
Also Published As
Publication number | Publication date |
---|---|
WO2022181555A1 (ja) | 2022-09-01 |
KR20230131918A (ko) | 2023-09-14 |
CN116848962A (zh) | 2023-10-03 |
US20230389246A1 (en) | 2023-11-30 |
JP7477042B2 (ja) | 2024-05-01 |
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