JPWO2022181113A1 - - Google Patents
Info
- Publication number
- JPWO2022181113A1 JPWO2022181113A1 JP2023502161A JP2023502161A JPWO2022181113A1 JP WO2022181113 A1 JPWO2022181113 A1 JP WO2022181113A1 JP 2023502161 A JP2023502161 A JP 2023502161A JP 2023502161 A JP2023502161 A JP 2023502161A JP WO2022181113 A1 JPWO2022181113 A1 JP WO2022181113A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0509—Holders; Supports for bulk acoustic wave devices consisting of adhesive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021030158 | 2021-02-26 | ||
PCT/JP2022/001322 WO2022181113A1 (ja) | 2021-02-26 | 2022-01-17 | 圧電素子及び圧電デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022181113A1 true JPWO2022181113A1 (ja) | 2022-09-01 |
JPWO2022181113A5 JPWO2022181113A5 (ja) | 2023-11-22 |
Family
ID=83048899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023502161A Pending JPWO2022181113A1 (ja) | 2021-02-26 | 2022-01-17 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230402994A1 (ja) |
JP (1) | JPWO2022181113A1 (ja) |
CN (1) | CN116868507A (ja) |
WO (1) | WO2022181113A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5141737B2 (ja) * | 2010-09-16 | 2013-02-13 | セイコーエプソン株式会社 | 水晶振動片及び水晶デバイスの製造方法、並びに水晶デバイス |
JP2013102015A (ja) * | 2011-11-08 | 2013-05-23 | Seiko Epson Corp | 電子デバイス、及び電子機器 |
JP2020136999A (ja) * | 2019-02-22 | 2020-08-31 | 京セラ株式会社 | 水晶素子、水晶デバイス及び電子機器 |
-
2022
- 2022-01-17 CN CN202280015654.4A patent/CN116868507A/zh active Pending
- 2022-01-17 JP JP2023502161A patent/JPWO2022181113A1/ja active Pending
- 2022-01-17 WO PCT/JP2022/001322 patent/WO2022181113A1/ja active Application Filing
-
2023
- 2023-08-16 US US18/450,827 patent/US20230402994A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230402994A1 (en) | 2023-12-14 |
CN116868507A (zh) | 2023-10-10 |
WO2022181113A1 (ja) | 2022-09-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230901 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230901 |