JPWO2022176519A1 - - Google Patents
Info
- Publication number
- JPWO2022176519A1 JPWO2022176519A1 JP2023500664A JP2023500664A JPWO2022176519A1 JP WO2022176519 A1 JPWO2022176519 A1 JP WO2022176519A1 JP 2023500664 A JP2023500664 A JP 2023500664A JP 2023500664 A JP2023500664 A JP 2023500664A JP WO2022176519 A1 JPWO2022176519 A1 JP WO2022176519A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022877 | 2021-02-16 | ||
| PCT/JP2022/002478 WO2022176519A1 (ja) | 2021-02-16 | 2022-01-24 | 電極形成用組成物、太陽電池素子及びアルミニウム／銀積層電極 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022176519A1 true JPWO2022176519A1 (zh) | 2022-08-25 |
Family
ID=82931536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023500664A Pending JPWO2022176519A1 (zh) | 2021-02-16 | 2022-01-24 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022176519A1 (zh) |
| TW (1) | TW202244944A (zh) |
| WO (1) | WO2022176519A1 (zh) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04270140A (ja) * | 1990-06-21 | 1992-09-25 | Johnson Matthey Inc | シーリングガラス組成物および導電性成分を含む同組成物 |
| US5188990A (en) * | 1991-11-21 | 1993-02-23 | Vlsi Packaging Materials | Low temperature sealing glass compositions |
| JP5525714B2 (ja) * | 2008-02-08 | 2014-06-18 | 日立粉末冶金株式会社 | ガラス組成物 |
| JP5673316B2 (ja) * | 2011-04-11 | 2015-02-18 | 日立化成株式会社 | 電子部品、それに適用されるアルミニウム電極用導電性ペースト、及びアルミニウム電極用ガラス組成物 |
| JP5891599B2 (ja) * | 2011-04-14 | 2016-03-23 | 日立化成株式会社 | シリコン系太陽電池の電極用ペースト組成物 |
| JP6027171B2 (ja) * | 2011-07-04 | 2016-11-16 | 株式会社日立製作所 | 封着用ガラスフリット、封着用ガラスペースト、導電性ガラスペースト、およびそれらを利用した電気電子部品 |
| JP2013074165A (ja) * | 2011-09-28 | 2013-04-22 | Yokohama Rubber Co Ltd:The | 太陽電池集電電極形成用導電性組成物、太陽電池セル、および太陽電池モジュール |
| JP5935120B2 (ja) * | 2012-06-22 | 2016-06-15 | 株式会社日立製作所 | 密封容器、電子装置及び太陽電池モジュール |
| WO2014014109A1 (ja) * | 2012-07-19 | 2014-01-23 | 日立化成株式会社 | パッシベーション層形成用組成物、パッシベーション層付半導体基板、パッシベーション層付半導体基板の製造方法、太陽電池素子、太陽電池素子の製造方法、及び太陽電池 |
| JP5733279B2 (ja) * | 2012-07-30 | 2015-06-10 | 日立化成株式会社 | 電子部品及びその製法、並びにそれに用いる封止材料ペースト |
| CN105474408B (zh) * | 2013-08-30 | 2018-01-02 | 京瓷株式会社 | 太阳能电池元件及其制造方法 |
| US9349883B2 (en) * | 2014-06-19 | 2016-05-24 | E I Du Pont De Nemours And Company | Conductor for a solar cell |
| KR102379829B1 (ko) * | 2018-02-23 | 2022-03-28 | 엘지전자 주식회사 | 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체 |
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2022
- 2022-01-24 WO PCT/JP2022/002478 patent/WO2022176519A1/ja active Application Filing
- 2022-01-24 JP JP2023500664A patent/JPWO2022176519A1/ja active Pending
- 2022-02-10 TW TW111104827A patent/TW202244944A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202244944A (zh) | 2022-11-16 |
| WO2022176519A1 (ja) | 2022-08-25 |