JPWO2022176143A1 - - Google Patents
Info
- Publication number
- JPWO2022176143A1 JPWO2022176143A1 JP2023500448A JP2023500448A JPWO2022176143A1 JP WO2022176143 A1 JPWO2022176143 A1 JP WO2022176143A1 JP 2023500448 A JP2023500448 A JP 2023500448A JP 2023500448 A JP2023500448 A JP 2023500448A JP WO2022176143 A1 JPWO2022176143 A1 JP WO2022176143A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/006256 WO2022176143A1 (ja) | 2021-02-19 | 2021-02-19 | プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022176143A1 true JPWO2022176143A1 (ja) | 2022-08-25 |
JPWO2022176143A5 JPWO2022176143A5 (ja) | 2023-04-28 |
JP7459368B2 JP7459368B2 (ja) | 2024-04-01 |
Family
ID=82930435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023500448A Active JP7459368B2 (ja) | 2021-02-19 | 2021-02-19 | プローブカード用アライメントチップ、プローブカード及びプローブカード補修方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240103071A1 (ja) |
JP (1) | JP7459368B2 (ja) |
KR (1) | KR20230044303A (ja) |
CN (1) | CN116194784A (ja) |
TW (1) | TW202234067A (ja) |
WO (1) | WO2022176143A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0196944A (ja) * | 1987-10-08 | 1989-04-14 | Nec Corp | 高周波特性測定装置 |
JPH11154694A (ja) * | 1997-11-21 | 1999-06-08 | Matsushita Electric Ind Co Ltd | ウェハ一括型測定検査用アライメント方法およびプローブカードの製造方法 |
US6429671B1 (en) | 1998-11-25 | 2002-08-06 | Advanced Micro Devices, Inc. | Electrical test probe card having a removable probe head assembly with alignment features and a method for aligning the probe head assembly to the probe card |
JP2001330626A (ja) | 2000-05-22 | 2001-11-30 | Micronics Japan Co Ltd | プローブカード及びこれにアライメントマークを形成する方法 |
JP4971636B2 (ja) | 2006-01-06 | 2012-07-11 | 川崎マイクロエレクトロニクス株式会社 | プローブカードの取り付け位置ずれの検出方法及びプローバ装置 |
CN101652664B (zh) | 2007-04-03 | 2011-10-05 | 株式会社爱德万测试 | 接触器的安装方法 |
JP2011117761A (ja) | 2009-12-01 | 2011-06-16 | Japan Electronic Materials Corp | プローブカードおよびプローブカードの製造方法 |
JP6348626B2 (ja) | 2017-02-23 | 2018-06-27 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
2021
- 2021-02-19 US US18/265,263 patent/US20240103071A1/en active Pending
- 2021-02-19 WO PCT/JP2021/006256 patent/WO2022176143A1/ja active Application Filing
- 2021-02-19 KR KR1020237007418A patent/KR20230044303A/ko unknown
- 2021-02-19 CN CN202180062337.3A patent/CN116194784A/zh active Pending
- 2021-02-19 JP JP2023500448A patent/JP7459368B2/ja active Active
- 2021-09-14 TW TW110134210A patent/TW202234067A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP7459368B2 (ja) | 2024-04-01 |
US20240103071A1 (en) | 2024-03-28 |
TW202234067A (zh) | 2022-09-01 |
CN116194784A (zh) | 2023-05-30 |
WO2022176143A1 (ja) | 2022-08-25 |
KR20230044303A (ko) | 2023-04-03 |
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