JPWO2022172855A1 - - Google Patents
Info
- Publication number
- JPWO2022172855A1 JPWO2022172855A1 JP2022580597A JP2022580597A JPWO2022172855A1 JP WO2022172855 A1 JPWO2022172855 A1 JP WO2022172855A1 JP 2022580597 A JP2022580597 A JP 2022580597A JP 2022580597 A JP2022580597 A JP 2022580597A JP WO2022172855 A1 JPWO2022172855 A1 JP WO2022172855A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021019836 | 2021-02-10 | ||
| PCT/JP2022/004283 WO2022172855A1 (en) | 2021-02-10 | 2022-02-03 | Composite material, heat spreader and semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022172855A1 true JPWO2022172855A1 (en) | 2022-08-18 |
Family
ID=82837861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022580597A Pending JPWO2022172855A1 (en) | 2021-02-10 | 2022-02-03 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022172855A1 (en) |
| WO (1) | WO2022172855A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3548991B2 (en) * | 1997-08-22 | 2004-08-04 | 株式会社アライドマテリアル | Heat dissipating substrate and manufacturing method thereof |
| JP3856640B2 (en) * | 2000-01-26 | 2006-12-13 | 株式会社アライドマテリアル | Semiconductor mounting heat dissipation substrate material, manufacturing method thereof, and ceramic package using the same |
| JP2002121639A (en) * | 2000-10-18 | 2002-04-26 | Sumitomo Electric Ind Ltd | Heat radiation substrate, and high-power high-frequency transistor package using it |
| JP6455896B1 (en) * | 2017-11-18 | 2019-01-23 | Jfe精密株式会社 | Heat sink and manufacturing method thereof |
| KR20200108599A (en) * | 2019-03-11 | 2020-09-21 | 주식회사 더굿시스템 | Heat sink plate |
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2022
- 2022-02-03 JP JP2022580597A patent/JPWO2022172855A1/ja active Pending
- 2022-02-03 WO PCT/JP2022/004283 patent/WO2022172855A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022172855A1 (en) | 2022-08-18 |