JPWO2022168545A1 - - Google Patents
Info
- Publication number
- JPWO2022168545A1 JPWO2022168545A1 JP2022579406A JP2022579406A JPWO2022168545A1 JP WO2022168545 A1 JPWO2022168545 A1 JP WO2022168545A1 JP 2022579406 A JP2022579406 A JP 2022579406A JP 2022579406 A JP2022579406 A JP 2022579406A JP WO2022168545 A1 JPWO2022168545 A1 JP WO2022168545A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/65—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to reset noise, e.g. KTC noise related to CMOS structures by techniques other than CDS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021018080 | 2021-02-08 | ||
PCT/JP2022/000737 WO2022168545A1 (ja) | 2021-02-08 | 2022-01-12 | 撮像装置および撮像装置の駆動方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022168545A1 true JPWO2022168545A1 (ja) | 2022-08-11 |
Family
ID=82741150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022579406A Pending JPWO2022168545A1 (ja) | 2021-02-08 | 2022-01-12 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230353899A1 (ja) |
JP (1) | JPWO2022168545A1 (ja) |
WO (1) | WO2022168545A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5039649B2 (ja) * | 2008-06-30 | 2012-10-03 | 富士フイルム株式会社 | 撮像装置及び撮像装置の撮影制御方法 |
JP4779054B1 (ja) * | 2010-03-31 | 2011-09-21 | 富士フイルム株式会社 | 固体撮像素子及び撮像装置 |
JP6174902B2 (ja) * | 2012-09-14 | 2017-08-02 | キヤノン株式会社 | 固体撮像装置及びカメラ |
JP6307771B2 (ja) * | 2014-12-26 | 2018-04-11 | パナソニックIpマネジメント株式会社 | 撮像装置 |
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2022
- 2022-01-12 WO PCT/JP2022/000737 patent/WO2022168545A1/ja active Application Filing
- 2022-01-12 JP JP2022579406A patent/JPWO2022168545A1/ja active Pending
-
2023
- 2023-07-10 US US18/349,199 patent/US20230353899A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022168545A1 (ja) | 2022-08-11 |
US20230353899A1 (en) | 2023-11-02 |