JPWO2022158076A1 - - Google Patents

Info

Publication number
JPWO2022158076A1
JPWO2022158076A1 JP2022576985A JP2022576985A JPWO2022158076A1 JP WO2022158076 A1 JPWO2022158076 A1 JP WO2022158076A1 JP 2022576985 A JP2022576985 A JP 2022576985A JP 2022576985 A JP2022576985 A JP 2022576985A JP WO2022158076 A1 JPWO2022158076 A1 JP WO2022158076A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022576985A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022158076A1 publication Critical patent/JPWO2022158076A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022576985A 2021-01-19 2021-10-27 Pending JPWO2022158076A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006638 2021-01-19
PCT/JP2021/039694 WO2022158076A1 (ja) 2021-01-19 2021-10-27 部品搭載装置および部品搭載方法

Publications (1)

Publication Number Publication Date
JPWO2022158076A1 true JPWO2022158076A1 (enrdf_load_stackoverflow) 2022-07-28

Family

ID=82548750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576985A Pending JPWO2022158076A1 (enrdf_load_stackoverflow) 2021-01-19 2021-10-27

Country Status (2)

Country Link
JP (1) JPWO2022158076A1 (enrdf_load_stackoverflow)
WO (1) WO2022158076A1 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135992A (ja) * 1997-10-31 1999-05-21 Victor Co Of Japan Ltd 部品搭載装置
JP2009004400A (ja) * 2007-06-19 2009-01-08 Yamaha Motor Co Ltd 実装機および部品吸着装置
JP2010199630A (ja) * 2002-11-13 2010-09-09 Fuji Mach Mfg Co Ltd 電子部品実装方法および装置
JP2019029563A (ja) * 2017-08-01 2019-02-21 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135992A (ja) * 1997-10-31 1999-05-21 Victor Co Of Japan Ltd 部品搭載装置
JP2010199630A (ja) * 2002-11-13 2010-09-09 Fuji Mach Mfg Co Ltd 電子部品実装方法および装置
JP2009004400A (ja) * 2007-06-19 2009-01-08 Yamaha Motor Co Ltd 実装機および部品吸着装置
JP2019029563A (ja) * 2017-08-01 2019-02-21 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Also Published As

Publication number Publication date
WO2022158076A1 (ja) 2022-07-28

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