JPWO2022145310A1 - - Google Patents
Info
- Publication number
- JPWO2022145310A1 JPWO2022145310A1 JP2022573023A JP2022573023A JPWO2022145310A1 JP WO2022145310 A1 JPWO2022145310 A1 JP WO2022145310A1 JP 2022573023 A JP2022573023 A JP 2022573023A JP 2022573023 A JP2022573023 A JP 2022573023A JP WO2022145310 A1 JPWO2022145310 A1 JP WO2022145310A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020219763 | 2020-12-29 | ||
| JP2020219763 | 2020-12-29 | ||
| PCT/JP2021/047572 WO2022145310A1 (en) | 2020-12-29 | 2021-12-22 | Method for manufacturing semiconductor device, method for manufacturing substrate for semiconductor device, semiconductor device, and power conversion device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022145310A1 true JPWO2022145310A1 (en) | 2022-07-07 |
| JP7450769B2 JP7450769B2 (en) | 2024-03-15 |
Family
ID=82260453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022573023A Active JP7450769B2 (en) | 2020-12-29 | 2021-12-22 | Method of manufacturing a semiconductor device, method of manufacturing a substrate for a semiconductor device, semiconductor device and power conversion device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7450769B2 (en) |
| WO (1) | WO2022145310A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024053084A1 (en) * | 2022-09-09 | 2024-03-14 | 三菱電機株式会社 | Semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001160606A (en) | 1999-09-21 | 2001-06-12 | Daichu Denshi Co Ltd | Heat dissipating sheet and its manufacturing method |
| JP2004298962A (en) * | 2003-03-17 | 2004-10-28 | Mitsubishi Materials Corp | Solder joining material and power module substrate utilizing the same |
| JP5989465B2 (en) | 2012-09-05 | 2016-09-07 | 昭和電工株式会社 | Insulating substrate manufacturing method |
-
2021
- 2021-12-22 JP JP2022573023A patent/JP7450769B2/en active Active
- 2021-12-22 WO PCT/JP2021/047572 patent/WO2022145310A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022145310A1 (en) | 2022-07-07 |
| JP7450769B2 (en) | 2024-03-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221201 |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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| A61 | First payment of annual fees (during grant procedure) |
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| R150 | Certificate of patent or registration of utility model |
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