JPWO2022145290A1 - - Google Patents
Info
- Publication number
- JPWO2022145290A1 JPWO2022145290A1 JP2022506652A JP2022506652A JPWO2022145290A1 JP WO2022145290 A1 JPWO2022145290 A1 JP WO2022145290A1 JP 2022506652 A JP2022506652 A JP 2022506652A JP 2022506652 A JP2022506652 A JP 2022506652A JP WO2022145290 A1 JPWO2022145290 A1 JP WO2022145290A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020218234A JP7061247B1 (en) | 2020-12-28 | 2020-12-28 | Nickel electrolytic plating film and plating structure |
JP2020218234 | 2020-12-28 | ||
PCT/JP2021/047335 WO2022145290A1 (en) | 2020-12-28 | 2021-12-21 | Plating structure comprising ni electrolytic plating film, and lead frame including said plating structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7096955B1 JP7096955B1 (en) | 2022-07-06 |
JPWO2022145290A1 true JPWO2022145290A1 (en) | 2022-07-07 |
Family
ID=81448161
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020218234A Active JP7061247B1 (en) | 2020-12-28 | 2020-12-28 | Nickel electrolytic plating film and plating structure |
JP2022506652A Active JP7096955B1 (en) | 2020-12-28 | 2021-12-21 | A plating structure provided with a Ni electrolytic plating film and a lead frame containing the plating structure. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020218234A Active JP7061247B1 (en) | 2020-12-28 | 2020-12-28 | Nickel electrolytic plating film and plating structure |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7061247B1 (en) |
CN (1) | CN116324002A (en) |
TW (2) | TWI787896B (en) |
WO (1) | WO2022145290A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116449063B (en) * | 2023-05-03 | 2024-07-16 | 苏州迪克微电子有限公司 | Palladium alloy probe structure with nickel-gold-palladium coating layer and electroplating method thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57145351A (en) * | 1981-03-04 | 1982-09-08 | Hitachi Cable Ltd | Lead frame for semiconductor |
JP3026485B2 (en) * | 1997-02-28 | 2000-03-27 | 日本電解株式会社 | Lead frame material and its manufacturing method |
US6117566A (en) * | 1997-02-03 | 2000-09-12 | Nippon Denkai, Ltd. | Lead frame material |
US6037653A (en) * | 1997-03-25 | 2000-03-14 | Samsung Aerospace Industries, Ltd. | Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer |
JPH10284667A (en) * | 1997-04-04 | 1998-10-23 | Furukawa Electric Co Ltd:The | Material for electric electronic device component having superior corrosion resistance and oxidation resistance |
JP2000077593A (en) * | 1998-08-27 | 2000-03-14 | Hitachi Cable Ltd | Lead frame for semiconductor |
CN100405881C (en) * | 2003-03-18 | 2008-07-23 | 日本特殊陶业株式会社 | Wiring board |
TW200530433A (en) * | 2004-01-21 | 2005-09-16 | Enthone | Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components |
US7256481B2 (en) * | 2005-11-30 | 2007-08-14 | Texas Instruments Incorporated | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
CN100392850C (en) * | 2006-05-29 | 2008-06-04 | 朱冬生 | Lead-frame and semi-conductor device with same |
CN103667775B (en) * | 2013-11-27 | 2016-04-13 | 余姚市士森铜材厂 | A kind of Copper alloy semiconductor lead frame |
JP2020017692A (en) * | 2018-07-27 | 2020-01-30 | Tdk株式会社 | Electronic component package |
-
2020
- 2020-12-28 JP JP2020218234A patent/JP7061247B1/en active Active
-
2021
- 2021-07-02 TW TW110124466A patent/TWI787896B/en active
- 2021-12-21 CN CN202180065149.6A patent/CN116324002A/en active Pending
- 2021-12-21 WO PCT/JP2021/047335 patent/WO2022145290A1/en active Application Filing
- 2021-12-21 JP JP2022506652A patent/JP7096955B1/en active Active
- 2021-12-27 TW TW110148835A patent/TWI790062B/en active
Also Published As
Publication number | Publication date |
---|---|
JP7061247B1 (en) | 2022-04-28 |
TW202233899A (en) | 2022-09-01 |
JP7096955B1 (en) | 2022-07-06 |
TWI787896B (en) | 2022-12-21 |
TW202225489A (en) | 2022-07-01 |
TWI790062B (en) | 2023-01-11 |
CN116324002A (en) | 2023-06-23 |
JP2022103538A (en) | 2022-07-08 |
WO2022145290A1 (en) | 2022-07-07 |
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