JPWO2022144997A5 - - Google Patents
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- Publication number
- JPWO2022144997A5 JPWO2022144997A5 JP2022505658A JP2022505658A JPWO2022144997A5 JP WO2022144997 A5 JPWO2022144997 A5 JP WO2022144997A5 JP 2022505658 A JP2022505658 A JP 2022505658A JP 2022505658 A JP2022505658 A JP 2022505658A JP WO2022144997 A5 JPWO2022144997 A5 JP WO2022144997A5
- Authority
- JP
- Japan
- Prior art keywords
- heater
- mounting head
- cooling
- head according
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000001816 cooling Methods 0.000 claims 12
- 239000002826 coolant Substances 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 2
- 238000013459 approach Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
Claims (5)
底面が前記チップを吸引保持する吸着面として機能する実装ツールと、
前記実装ツールの前記吸着面とは反対側の面に配置され、前記実装ツールを加熱するヒータと、
前記ヒータに設定された複数の冷却エリアそれぞれに冷媒を導くとともに互いに独立した複数の冷却流路を有し、前記複数の冷却エリアを互いに独立して冷却可能な冷却機構と、
前記ヒータおよび前記冷却機構の駆動を制御するコントローラと、
を備え、前記コントローラは、前記ヒータの加熱時に、所望の温度分布が得られるように、複数の前記冷却流路に流す前記冷媒の流量を互いに独立して制御する、
ことを特徴とする実装ヘッド。A mounting head for bonding a chip to a bonding object,
a mounting tool whose bottom surface functions as a suction surface for suctioning and holding the chip;
a heater disposed on the surface of the mounting tool opposite to the suction surface for heating the mounting tool;
a cooling mechanism that guides a coolant to each of a plurality of cooling areas set in the heater, has a plurality of cooling channels that are independent of each other, and can cool the plurality of cooling areas independently of each other;
a controller that controls driving of the heater and the cooling mechanism;
wherein the controller independently controls flow rates of the coolant flowing through the plurality of cooling channels so as to obtain a desired temperature distribution when the heater is heated;
A mounting head characterized by:
前記コントローラは、予め、温度分布と、前記ヒータの駆動条件と、複数の前記冷却流路に流す前記冷媒の流量と、との関係を記録した条件データを記憶しており、前記条件データに基づいて、前記ヒータおよび前記冷却機構の駆動を制御する、ことを特徴とする実装ヘッド。The mounting head according to claim 1,
The controller stores in advance condition data recording the relationship among the temperature distribution, the driving condition of the heater, and the flow rate of the coolant flowing through the plurality of cooling channels, and based on the condition data to control the driving of the heater and the cooling mechanism.
前記冷却流路の流路断面積は、前記ヒータに近づくにつれて段階的に大きくなる、ことを特徴とする実装ヘッド。The mounting head according to claim 1 or 2,
The mounting head according to claim 1, wherein the cross-sectional area of the cooling channel increases stepwise as it approaches the heater.
前記コントローラは、前記チップの加熱処理、および、前記加熱処理の後に行われる前記チップの冷却処理の両方において、複数の前記冷却流路に前記冷媒を流させる、ことを特徴とする実装ヘッド。The mounting head according to any one of claims 1 to 3,
The mounting head according to claim 1, wherein the controller causes the coolant to flow through the plurality of cooling channels in both the heat treatment of the chip and the cooling treatment of the chip performed after the heat treatment.
前記ヒータは、前記吸着面と同形のセラミックスの内部に発熱抵抗体を埋め込んだ単一のセラミックヒータであり、
前記コントローラは、前記ヒータの加熱時に、温度分布が均一になるように、複数の前記冷却流路に流す前記冷媒の流量を互いに独立して制御する、
ことを特徴とする実装ヘッド。The mounting head according to any one of claims 1 to 4,
The heater is a single ceramic heater in which a heating resistor is embedded in ceramics having the same shape as the adsorption surface,
The controller independently controls the flow rate of the coolant flowing through the plurality of cooling channels so that the temperature distribution is uniform when the heater is heated.
A mounting head characterized by:
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/049184 WO2022144997A1 (en) | 2020-12-28 | 2020-12-28 | Mounting head |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022144997A1 JPWO2022144997A1 (en) | 2022-07-07 |
| JP7178150B1 JP7178150B1 (en) | 2022-11-25 |
| JPWO2022144997A5 true JPWO2022144997A5 (en) | 2022-12-08 |
Family
ID=82259138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022505658A Active JP7178150B1 (en) | 2020-12-28 | 2020-12-28 | mounting head |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240063170A1 (en) |
| JP (1) | JP7178150B1 (en) |
| KR (1) | KR20230070313A (en) |
| CN (1) | CN114981939A (en) |
| TW (1) | TWI808527B (en) |
| WO (1) | WO2022144997A1 (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3189471B2 (en) * | 1993-03-11 | 2001-07-16 | 松下電器産業株式会社 | Thermocompression bonding head for electronic components |
| JP3255871B2 (en) * | 1997-03-31 | 2002-02-12 | 住友大阪セメント株式会社 | Manufacturing method of pulse heater and semiconductor chip mounting board |
| JP2000216140A (en) * | 1999-01-20 | 2000-08-04 | Hitachi Ltd | Wafer stage and wafer treating apparatus |
| JP4898556B2 (en) * | 2007-05-23 | 2012-03-14 | 株式会社日立ハイテクノロジーズ | Plasma processing equipment |
| JP2012199358A (en) * | 2011-03-22 | 2012-10-18 | Nec Corp | Chip heating head |
| US9105629B2 (en) * | 2013-03-07 | 2015-08-11 | International Business Machines Corporation | Selective area heating for 3D chip stack |
| JP6405999B2 (en) * | 2014-12-25 | 2018-10-17 | 富士通株式会社 | Chip bonding apparatus and chip bonding method |
| JP6047724B2 (en) * | 2016-03-29 | 2016-12-21 | 株式会社新川 | Heater for bonding apparatus, heater assembly for bonding apparatus, and bonding apparatus |
| JP6850854B2 (en) * | 2019-11-18 | 2021-03-31 | 東レエンジニアリング株式会社 | Bonding head and mounting device |
-
2020
- 2020-12-28 WO PCT/JP2020/049184 patent/WO2022144997A1/en active Application Filing
- 2020-12-28 US US18/269,949 patent/US20240063170A1/en active Pending
- 2020-12-28 KR KR1020237014293A patent/KR20230070313A/en active Search and Examination
- 2020-12-28 JP JP2022505658A patent/JP7178150B1/en active Active
- 2020-12-28 CN CN202080053494.3A patent/CN114981939A/en active Pending
-
2021
- 2021-11-08 TW TW110141450A patent/TWI808527B/en active
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