JPWO2022138518A1 - - Google Patents
Info
- Publication number
- JPWO2022138518A1 JPWO2022138518A1 JP2022571420A JP2022571420A JPWO2022138518A1 JP WO2022138518 A1 JPWO2022138518 A1 JP WO2022138518A1 JP 2022571420 A JP2022571420 A JP 2022571420A JP 2022571420 A JP2022571420 A JP 2022571420A JP WO2022138518 A1 JPWO2022138518 A1 JP WO2022138518A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/207—Uniting glass rods, glass tubes, or hollow glassware
- C03B23/213—Joining projections or feet
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Glass Compositions (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020213972 | 2020-12-23 | ||
PCT/JP2021/046890 WO2022138518A1 (ja) | 2020-12-23 | 2021-12-17 | 外枠付きカバーガラス |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022138518A1 true JPWO2022138518A1 (zh) | 2022-06-30 |
Family
ID=82157854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022571420A Pending JPWO2022138518A1 (zh) | 2020-12-23 | 2021-12-17 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022138518A1 (zh) |
CN (1) | CN116670082A (zh) |
TW (1) | TW202226465A (zh) |
WO (1) | WO2022138518A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024024530A1 (ja) * | 2022-07-29 | 2024-02-01 | Agc株式会社 | 外枠付きカバーガラス、半導体発光装置及び半導体受光装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010177375A (ja) * | 2009-01-28 | 2010-08-12 | Citizen Electronics Co Ltd | 発光装置及び発光装置の製造方法 |
JP2020057736A (ja) * | 2018-10-04 | 2020-04-09 | 日本電気硝子株式会社 | 気密パッケージ |
-
2021
- 2021-12-17 WO PCT/JP2021/046890 patent/WO2022138518A1/ja active Application Filing
- 2021-12-17 JP JP2022571420A patent/JPWO2022138518A1/ja active Pending
- 2021-12-17 CN CN202180087136.9A patent/CN116670082A/zh active Pending
- 2021-12-21 TW TW110147846A patent/TW202226465A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022138518A1 (ja) | 2022-06-30 |
TW202226465A (zh) | 2022-07-01 |
CN116670082A (zh) | 2023-08-29 |