JPWO2022137994A1 - - Google Patents
Info
- Publication number
- JPWO2022137994A1 JPWO2022137994A1 JP2022572016A JP2022572016A JPWO2022137994A1 JP WO2022137994 A1 JPWO2022137994 A1 JP WO2022137994A1 JP 2022572016 A JP2022572016 A JP 2022572016A JP 2022572016 A JP2022572016 A JP 2022572016A JP WO2022137994 A1 JPWO2022137994 A1 JP WO2022137994A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020214146 | 2020-12-23 | ||
| PCT/JP2021/043620 WO2022137994A1 (en) | 2020-12-23 | 2021-11-29 | Thermally conductive layer-forming sheet and method for producing thermally conductive layer-forming sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022137994A1 true JPWO2022137994A1 (en) | 2022-06-30 |
Family
ID=82157671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022572016A Pending JPWO2022137994A1 (en) | 2020-12-23 | 2021-11-29 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022137994A1 (en) |
| TW (1) | TW202229483A (en) |
| WO (1) | WO2022137994A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110965A (en) * | 1999-10-07 | 2001-04-20 | Fujikura Ltd | Adhesive sheet with high thermal conductivity |
| JP3419399B2 (en) * | 2001-04-20 | 2003-06-23 | 松下電器産業株式会社 | Graphite sheet and heat dissipation component using it |
| US20140079913A1 (en) * | 2011-03-28 | 2014-03-20 | Tomoo Nishiyama | Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor device |
| WO2016163537A1 (en) * | 2015-04-10 | 2016-10-13 | 株式会社カネカ | Graphite composite film and method for producing same, and heat-dissipating part |
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2021
- 2021-11-29 JP JP2022572016A patent/JPWO2022137994A1/ja active Pending
- 2021-11-29 WO PCT/JP2021/043620 patent/WO2022137994A1/en active Application Filing
- 2021-12-07 TW TW110145738A patent/TW202229483A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202229483A (en) | 2022-08-01 |
| WO2022137994A1 (en) | 2022-06-30 |