JPWO2022210419A1 - - Google Patents
Info
- Publication number
- JPWO2022210419A1 JPWO2022210419A1 JP2023511201A JP2023511201A JPWO2022210419A1 JP WO2022210419 A1 JPWO2022210419 A1 JP WO2022210419A1 JP 2023511201 A JP2023511201 A JP 2023511201A JP 2023511201 A JP2023511201 A JP 2023511201A JP WO2022210419 A1 JPWO2022210419 A1 JP WO2022210419A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021061339 | 2021-03-31 | ||
| PCT/JP2022/014652 WO2022210419A1 (en) | 2021-03-31 | 2022-03-25 | Method for manufacturing thermally conductive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210419A1 true JPWO2022210419A1 (en) | 2022-10-06 |
Family
ID=83456230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511201A Pending JPWO2022210419A1 (en) | 2021-03-31 | 2022-03-25 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022210419A1 (en) |
| TW (1) | TW202248310A (en) |
| WO (1) | WO2022210419A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833044B (en) | 2022-04-24 | 2023-01-13 | 浙江大学 | Automatic production device for high-heat-conductivity flocking pad |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017135137A (en) * | 2016-01-25 | 2017-08-03 | 東洋紡株式会社 | Insulating high thermal conductive sheet, manufacturing method of the same, and laminate |
| CN110249424A (en) * | 2017-02-02 | 2019-09-17 | 株式会社钟化 | Interlayer thermal bonding component, interlayer thermal bonding method, the manufacturing method of interlayer thermal bonding component |
| CN112715059B (en) * | 2018-09-26 | 2024-09-06 | 积水保力马科技株式会社 | Heat conducting fin |
-
2022
- 2022-03-25 JP JP2023511201A patent/JPWO2022210419A1/ja active Pending
- 2022-03-25 WO PCT/JP2022/014652 patent/WO2022210419A1/en active Application Filing
- 2022-03-29 TW TW111111953A patent/TW202248310A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022210419A1 (en) | 2022-10-06 |
| TW202248310A (en) | 2022-12-16 |