JPWO2022130799A1 - - Google Patents

Info

Publication number
JPWO2022130799A1
JPWO2022130799A1 JP2022569754A JP2022569754A JPWO2022130799A1 JP WO2022130799 A1 JPWO2022130799 A1 JP WO2022130799A1 JP 2022569754 A JP2022569754 A JP 2022569754A JP 2022569754 A JP2022569754 A JP 2022569754A JP WO2022130799 A1 JPWO2022130799 A1 JP WO2022130799A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022569754A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022130799A1 publication Critical patent/JPWO2022130799A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
JP2022569754A 2020-12-15 2021-10-28 Pending JPWO2022130799A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020207619 2020-12-15
PCT/JP2021/039851 WO2022130799A1 (ja) 2020-12-15 2021-10-28 蓋部材、パッケージ及びガラス基板

Publications (1)

Publication Number Publication Date
JPWO2022130799A1 true JPWO2022130799A1 (zh) 2022-06-23

Family

ID=82057517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022569754A Pending JPWO2022130799A1 (zh) 2020-12-15 2021-10-28

Country Status (5)

Country Link
JP (1) JPWO2022130799A1 (zh)
KR (1) KR20230119107A (zh)
CN (1) CN116438669A (zh)
TW (1) TW202226622A (zh)
WO (1) WO2022130799A1 (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4350144B2 (ja) * 2007-08-09 2009-10-21 シャープ株式会社 発光装置およびこれを備える照明装置
JP2011066169A (ja) 2009-09-16 2011-03-31 Toyoda Gosei Co Ltd Ledパッケージ
JP5470171B2 (ja) * 2010-06-21 2014-04-16 株式会社エンプラス 発光装置、面光源装置、表示装置及び光束制御部材
CN103367609B (zh) * 2012-03-28 2016-05-18 中央大学 低空间色偏的led封装结构
JP2019046826A (ja) * 2017-08-29 2019-03-22 クアーズテック株式会社 シリカ部材及びその製造方法
EP3599414A1 (en) * 2018-07-23 2020-01-29 Shin-Etsu Chemical Co., Ltd. Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods

Also Published As

Publication number Publication date
CN116438669A (zh) 2023-07-14
TW202226622A (zh) 2022-07-01
WO2022130799A1 (ja) 2022-06-23
KR20230119107A (ko) 2023-08-16

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