JPWO2022130799A1 - - Google Patents
Info
- Publication number
- JPWO2022130799A1 JPWO2022130799A1 JP2022569754A JP2022569754A JPWO2022130799A1 JP WO2022130799 A1 JPWO2022130799 A1 JP WO2022130799A1 JP 2022569754 A JP2022569754 A JP 2022569754A JP 2022569754 A JP2022569754 A JP 2022569754A JP WO2022130799 A1 JPWO2022130799 A1 JP WO2022130799A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020207619 | 2020-12-15 | ||
PCT/JP2021/039851 WO2022130799A1 (ja) | 2020-12-15 | 2021-10-28 | 蓋部材、パッケージ及びガラス基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022130799A1 true JPWO2022130799A1 (zh) | 2022-06-23 |
Family
ID=82057517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022569754A Pending JPWO2022130799A1 (zh) | 2020-12-15 | 2021-10-28 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022130799A1 (zh) |
KR (1) | KR20230119107A (zh) |
CN (1) | CN116438669A (zh) |
TW (1) | TW202226622A (zh) |
WO (1) | WO2022130799A1 (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4350144B2 (ja) * | 2007-08-09 | 2009-10-21 | シャープ株式会社 | 発光装置およびこれを備える照明装置 |
JP2011066169A (ja) | 2009-09-16 | 2011-03-31 | Toyoda Gosei Co Ltd | Ledパッケージ |
JP5470171B2 (ja) * | 2010-06-21 | 2014-04-16 | 株式会社エンプラス | 発光装置、面光源装置、表示装置及び光束制御部材 |
CN103367609B (zh) * | 2012-03-28 | 2016-05-18 | 中央大学 | 低空间色偏的led封装结构 |
JP2019046826A (ja) * | 2017-08-29 | 2019-03-22 | クアーズテック株式会社 | シリカ部材及びその製造方法 |
EP3599414B1 (en) * | 2018-07-23 | 2024-09-04 | Shin-Etsu Chemical Co., Ltd. | Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods |
-
2021
- 2021-10-28 CN CN202180074006.1A patent/CN116438669A/zh active Pending
- 2021-10-28 WO PCT/JP2021/039851 patent/WO2022130799A1/ja active Application Filing
- 2021-10-28 JP JP2022569754A patent/JPWO2022130799A1/ja active Pending
- 2021-10-28 KR KR1020237007804A patent/KR20230119107A/ko active Search and Examination
- 2021-10-29 TW TW110140307A patent/TW202226622A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230119107A (ko) | 2023-08-16 |
CN116438669A (zh) | 2023-07-14 |
WO2022130799A1 (ja) | 2022-06-23 |
TW202226622A (zh) | 2022-07-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240521 |