JPWO2022124005A1 - - Google Patents
Info
- Publication number
- JPWO2022124005A1 JPWO2022124005A1 JP2022568131A JP2022568131A JPWO2022124005A1 JP WO2022124005 A1 JPWO2022124005 A1 JP WO2022124005A1 JP 2022568131 A JP2022568131 A JP 2022568131A JP 2022568131 A JP2022568131 A JP 2022568131A JP WO2022124005 A1 JPWO2022124005 A1 JP WO2022124005A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020205771 | 2020-12-11 | ||
| PCT/JP2021/041713 WO2022124005A1 (fr) | 2020-12-11 | 2021-11-12 | Composition durcissable, matériau thermoconducteur, feuille thermoconductrice et dispositif à couche thermoconductrice |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022124005A1 true JPWO2022124005A1 (fr) | 2022-06-16 |
Family
ID=81974346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022568131A Pending JPWO2022124005A1 (fr) | 2020-12-11 | 2021-11-12 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022124005A1 (fr) |
| WO (1) | WO2022124005A1 (fr) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102161871A (zh) * | 2011-03-09 | 2011-08-24 | 烟台德邦电子材料有限公司 | 一种大功率led用导热绝缘胶带及其制备方法 |
| WO2015194901A1 (fr) * | 2014-06-19 | 2015-12-23 | Lg Innotek Co., Ltd. | Charge inorganique, composition de résine époxy la contenant et élément électroluminescent comportant une couche isolante à base de cette composition |
| US11866635B2 (en) * | 2015-11-19 | 2024-01-09 | Sekisui Chemical Co., Ltd. | Thermosetting material and cured product |
| JP2019167436A (ja) * | 2018-03-23 | 2019-10-03 | 三菱ケミカル株式会社 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
| CN109251624A (zh) * | 2018-07-27 | 2019-01-22 | 佛山市高明区生产力促进中心 | 一种耐高温的陶瓷涂料 |
| CN109054302A (zh) * | 2018-08-02 | 2018-12-21 | 中国科学院深圳先进技术研究院 | 热界面材料及其制备方法 |
| CN109852274B (zh) * | 2018-12-29 | 2021-06-15 | 苏州环明电子科技有限公司 | 一种石墨烯导热胶膜及其制备工艺 |
| KR102579529B1 (ko) * | 2019-01-23 | 2023-09-15 | 후지필름 가부시키가이샤 | 조성물, 열전도 시트, 열전도층 부착 디바이스 |
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2021
- 2021-11-12 JP JP2022568131A patent/JPWO2022124005A1/ja active Pending
- 2021-11-12 WO PCT/JP2021/041713 patent/WO2022124005A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022124005A1 (fr) | 2022-06-16 |