JPWO2022118364A1 - - Google Patents

Info

Publication number
JPWO2022118364A1
JPWO2022118364A1 JP2022566519A JP2022566519A JPWO2022118364A1 JP WO2022118364 A1 JPWO2022118364 A1 JP WO2022118364A1 JP 2022566519 A JP2022566519 A JP 2022566519A JP 2022566519 A JP2022566519 A JP 2022566519A JP WO2022118364 A1 JPWO2022118364 A1 JP WO2022118364A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022566519A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022118364A1 publication Critical patent/JPWO2022118364A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
JP2022566519A 2020-12-01 2020-12-01 Pending JPWO2022118364A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/044615 WO2022118364A1 (en) 2020-12-01 2020-12-01 Manufacturing method of electrolyte film supported reducing electrode

Publications (1)

Publication Number Publication Date
JPWO2022118364A1 true JPWO2022118364A1 (en) 2022-06-09

Family

ID=81852982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022566519A Pending JPWO2022118364A1 (en) 2020-12-01 2020-12-01

Country Status (2)

Country Link
JP (1) JPWO2022118364A1 (en)
WO (1) WO2022118364A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS425014B1 (en) * 1962-09-20 1967-03-01
JPS5538934A (en) * 1978-09-07 1980-03-18 Agency Of Ind Science & Technol Production of ion exchange membrane-catalyst electrode bonded material
JPS58185790A (en) * 1982-04-20 1983-10-29 Hitachi Zosen Corp Formation of electrode on ion exchange membrane
JP4350990B2 (en) * 2002-08-23 2009-10-28 イーメックス株式会社 Electrode forming method by plating, laminated body, and apparatus using this laminated body
JP5248792B2 (en) * 2007-03-15 2013-07-31 三菱電機株式会社 Dehumidifying element and manufacturing method thereof
KR20170138813A (en) * 2016-06-08 2017-12-18 (주)엘켐텍 Photo-water splitting cell with photoanode coated Pt MEA and its manufacture
JP7121318B2 (en) * 2018-12-10 2022-08-18 日本電信電話株式会社 Apparatus for gas phase reduction of carbon dioxide and method for gas phase reduction of carbon dioxide

Also Published As

Publication number Publication date
WO2022118364A1 (en) 2022-06-09

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230428