JPWO2022113921A1 - - Google Patents
Info
- Publication number
- JPWO2022113921A1 JPWO2022113921A1 JP2022565313A JP2022565313A JPWO2022113921A1 JP WO2022113921 A1 JPWO2022113921 A1 JP WO2022113921A1 JP 2022565313 A JP2022565313 A JP 2022565313A JP 2022565313 A JP2022565313 A JP 2022565313A JP WO2022113921 A1 JPWO2022113921 A1 JP WO2022113921A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020194843 | 2020-11-25 | ||
| PCT/JP2021/042716 WO2022113921A1 (en) | 2020-11-25 | 2021-11-22 | Semiconductor package and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022113921A1 true JPWO2022113921A1 (en) | 2022-06-02 |
Family
ID=81754606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565313A Pending JPWO2022113921A1 (en) | 2020-11-25 | 2021-11-22 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022113921A1 (en) |
| TW (1) | TW202236443A (en) |
| WO (1) | WO2022113921A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111897A (en) * | 1997-10-03 | 1999-04-23 | Hitachi Ltd | Multi-chip semiconductor device |
| US6162663A (en) * | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| JP5098392B2 (en) * | 2007-03-28 | 2012-12-12 | 株式会社豊田自動織機 | Semiconductor device |
| JP5120320B2 (en) * | 2009-04-09 | 2013-01-16 | 富士通株式会社 | Package structure, printed circuit board on which the package structure is mounted, and electronic apparatus having the printed circuit board |
| JP2011035320A (en) * | 2009-08-05 | 2011-02-17 | Toyota Motor Corp | Bonding structure of substrate |
-
2021
- 2021-11-22 JP JP2022565313A patent/JPWO2022113921A1/ja active Pending
- 2021-11-22 WO PCT/JP2021/042716 patent/WO2022113921A1/en active Application Filing
- 2021-11-24 TW TW110143663A patent/TW202236443A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202236443A (en) | 2022-09-16 |
| WO2022113921A1 (en) | 2022-06-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230516 |