JPWO2022107479A1 - - Google Patents

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Publication number
JPWO2022107479A1
JPWO2022107479A1 JP2022563619A JP2022563619A JPWO2022107479A1 JP WO2022107479 A1 JPWO2022107479 A1 JP WO2022107479A1 JP 2022563619 A JP2022563619 A JP 2022563619A JP 2022563619 A JP2022563619 A JP 2022563619A JP WO2022107479 A1 JPWO2022107479 A1 JP WO2022107479A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022563619A
Other languages
Japanese (ja)
Other versions
JP7222448B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022107479A1 publication Critical patent/JPWO2022107479A1/ja
Application granted granted Critical
Publication of JP7222448B2 publication Critical patent/JP7222448B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022563619A 2020-11-19 2021-10-07 heat spreading device Active JP7222448B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020192588 2020-11-19
JP2020192588 2020-11-19
PCT/JP2021/037157 WO2022107479A1 (en) 2020-11-19 2021-10-07 Heat spreading device

Publications (2)

Publication Number Publication Date
JPWO2022107479A1 true JPWO2022107479A1 (en) 2022-05-27
JP7222448B2 JP7222448B2 (en) 2023-02-15

Family

ID=81708789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022563619A Active JP7222448B2 (en) 2020-11-19 2021-10-07 heat spreading device

Country Status (3)

Country Link
JP (1) JP7222448B2 (en)
CN (1) CN220189635U (en)
WO (1) WO2022107479A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2762508Y (en) * 2004-12-22 2006-03-01 珍通科技股份有限公司 Bent type radiating plate
US20120111541A1 (en) * 2010-11-09 2012-05-10 Foxconn Technology Co., Ltd. Plate type heat pipe and heat sink using the same
US20120305222A1 (en) * 2011-05-31 2012-12-06 Asia Vital Components Co., Ltd. Heat spreader structure and manufacturing method thereof
JP2015088882A (en) * 2013-10-30 2015-05-07 東芝ホームテクノ株式会社 Portable information terminal
JP2017187126A (en) * 2016-04-07 2017-10-12 三菱電機株式会社 Vacuum heat insulating device and method of manufacturing the same
CN108036664A (en) * 2017-12-21 2018-05-15 奇鋐科技股份有限公司 Radiator compression-resistant structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2762508Y (en) * 2004-12-22 2006-03-01 珍通科技股份有限公司 Bent type radiating plate
US20120111541A1 (en) * 2010-11-09 2012-05-10 Foxconn Technology Co., Ltd. Plate type heat pipe and heat sink using the same
US20120305222A1 (en) * 2011-05-31 2012-12-06 Asia Vital Components Co., Ltd. Heat spreader structure and manufacturing method thereof
JP2015088882A (en) * 2013-10-30 2015-05-07 東芝ホームテクノ株式会社 Portable information terminal
JP2017187126A (en) * 2016-04-07 2017-10-12 三菱電機株式会社 Vacuum heat insulating device and method of manufacturing the same
CN108036664A (en) * 2017-12-21 2018-05-15 奇鋐科技股份有限公司 Radiator compression-resistant structure

Also Published As

Publication number Publication date
JP7222448B2 (en) 2023-02-15
CN220189635U (en) 2023-12-15
WO2022107479A1 (en) 2022-05-27

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