JPWO2022102756A1 - - Google Patents
Info
- Publication number
- JPWO2022102756A1 JPWO2022102756A1 JP2022562210A JP2022562210A JPWO2022102756A1 JP WO2022102756 A1 JPWO2022102756 A1 JP WO2022102756A1 JP 2022562210 A JP2022562210 A JP 2022562210A JP 2022562210 A JP2022562210 A JP 2022562210A JP WO2022102756 A1 JPWO2022102756 A1 JP WO2022102756A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
- C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020189016 | 2020-11-12 | ||
PCT/JP2021/041791 WO2022102756A1 (en) | 2020-11-12 | 2021-11-12 | Resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022102756A1 true JPWO2022102756A1 (en) | 2022-05-19 |
Family
ID=81602440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022562210A Pending JPWO2022102756A1 (en) | 2020-11-12 | 2021-11-12 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022102756A1 (en) |
TW (1) | TW202233705A (en) |
WO (1) | WO2022102756A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202342605A (en) * | 2022-03-11 | 2023-11-01 | 日商三菱瓦斯化學股份有限公司 | Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI814899B (en) * | 2018-09-12 | 2023-09-11 | 日商日本化藥股份有限公司 | Maleimide resin, curable resin composition and cured product |
KR20210056996A (en) * | 2018-09-12 | 2021-05-20 | 니폰 가야꾸 가부시끼가이샤 | Maleimide resin, curable resin composition and cured product thereof |
WO2020217675A1 (en) * | 2019-04-26 | 2020-10-29 | Dic株式会社 | Curable resin composition |
JP6799803B1 (en) * | 2019-04-26 | 2020-12-16 | Dic株式会社 | Curable resin composition |
JP2021116423A (en) * | 2020-01-21 | 2021-08-10 | 日本化薬株式会社 | Curable resin composition and cured product thereof |
WO2021182360A1 (en) * | 2020-03-11 | 2021-09-16 | 日本化薬株式会社 | Maleimide resin and method for producing same, maleimide solution, and curable resin composition and cured product thereof |
-
2021
- 2021-11-11 TW TW110142075A patent/TW202233705A/en unknown
- 2021-11-12 JP JP2022562210A patent/JPWO2022102756A1/ja active Pending
- 2021-11-12 WO PCT/JP2021/041791 patent/WO2022102756A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW202233705A (en) | 2022-09-01 |
WO2022102756A1 (en) | 2022-05-19 |
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