JPWO2022097483A1 - - Google Patents

Info

Publication number
JPWO2022097483A1
JPWO2022097483A1 JP2022533169A JP2022533169A JPWO2022097483A1 JP WO2022097483 A1 JPWO2022097483 A1 JP WO2022097483A1 JP 2022533169 A JP2022533169 A JP 2022533169A JP 2022533169 A JP2022533169 A JP 2022533169A JP WO2022097483 A1 JPWO2022097483 A1 JP WO2022097483A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533169A
Other languages
Japanese (ja)
Other versions
JP7260065B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097483A1 publication Critical patent/JPWO2022097483A1/ja
Application granted granted Critical
Publication of JP7260065B2 publication Critical patent/JP7260065B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
JP2022533169A 2020-11-05 2021-10-21 Laminate for semi-additive construction method and printed wiring board using the same Active JP7260065B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020184976 2020-11-05
JP2020184976 2020-11-05
PCT/JP2021/038871 WO2022097483A1 (en) 2020-11-05 2021-10-21 Multilayer body for semi-additive process and printed wiring board using same

Publications (2)

Publication Number Publication Date
JPWO2022097483A1 true JPWO2022097483A1 (en) 2022-05-12
JP7260065B2 JP7260065B2 (en) 2023-04-18

Family

ID=81457262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533169A Active JP7260065B2 (en) 2020-11-05 2021-10-21 Laminate for semi-additive construction method and printed wiring board using the same

Country Status (5)

Country Link
JP (1) JP7260065B2 (en)
KR (1) KR20230098582A (en)
CN (1) CN116420433A (en)
TW (1) TW202234963A (en)
WO (1) WO2022097483A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101398A (en) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd Copper foil with silver coating layer and copper clad laminate using it
JP2010021163A (en) * 2006-11-02 2010-01-28 Alps Electric Co Ltd Through electrode circuit substrate and forming method thereof
WO2020003881A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method for producing molded body having metal pattern
WO2020003879A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method for producing molded body having metal pattern
WO2020003877A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method of manufacturing printed wiring board
WO2020003878A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method of manufacturing printed wiring board
WO2020003880A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Multilayer body for printed wiring boards and printed wiring board using same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425030D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
JP3570802B2 (en) 1995-11-14 2004-09-29 三井化学株式会社 Copper thin film substrate and printed wiring board
JP2007122952A (en) * 2005-10-26 2007-05-17 Auto Network Gijutsu Kenkyusho:Kk Connection structure of press-fit terminal and board
US10021789B2 (en) 2007-07-02 2018-07-10 Ebara-Udylite Co., Ltd. Metal-laminated polyimide substrate, and method for production thereof
JP2010272837A (en) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101398A (en) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd Copper foil with silver coating layer and copper clad laminate using it
JP2010021163A (en) * 2006-11-02 2010-01-28 Alps Electric Co Ltd Through electrode circuit substrate and forming method thereof
WO2020003881A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method for producing molded body having metal pattern
WO2020003879A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method for producing molded body having metal pattern
WO2020003877A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method of manufacturing printed wiring board
WO2020003878A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method of manufacturing printed wiring board
WO2020003880A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Multilayer body for printed wiring boards and printed wiring board using same

Also Published As

Publication number Publication date
CN116420433A (en) 2023-07-11
TW202234963A (en) 2022-09-01
WO2022097483A1 (en) 2022-05-12
JP7260065B2 (en) 2023-04-18
KR20230098582A (en) 2023-07-04

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