JPWO2022097485A1 - - Google Patents

Info

Publication number
JPWO2022097485A1
JPWO2022097485A1 JP2022533165A JP2022533165A JPWO2022097485A1 JP WO2022097485 A1 JPWO2022097485 A1 JP WO2022097485A1 JP 2022533165 A JP2022533165 A JP 2022533165A JP 2022533165 A JP2022533165 A JP 2022533165A JP WO2022097485 A1 JPWO2022097485 A1 JP WO2022097485A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022533165A
Other languages
Japanese (ja)
Other versions
JP7332049B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2022097485A1 publication Critical patent/JPWO2022097485A1/ja
Application granted granted Critical
Publication of JP7332049B2 publication Critical patent/JP7332049B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2022533165A 2020-11-05 2021-10-21 Laminate for semi-additive construction method and printed wiring board using the same Active JP7332049B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020184978 2020-11-05
JP2020184978 2020-11-05
PCT/JP2021/038873 WO2022097485A1 (en) 2020-11-05 2021-10-21 Laminate for semi-additive manufacturing and printed wiring board using same

Publications (2)

Publication Number Publication Date
JPWO2022097485A1 true JPWO2022097485A1 (en) 2022-05-12
JP7332049B2 JP7332049B2 (en) 2023-08-23

Family

ID=81457874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533165A Active JP7332049B2 (en) 2020-11-05 2021-10-21 Laminate for semi-additive construction method and printed wiring board using the same

Country Status (5)

Country Link
JP (1) JP7332049B2 (en)
KR (1) KR20230104148A (en)
CN (1) CN116472785A (en)
TW (1) TW202236907A (en)
WO (1) WO2022097485A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111373A (en) * 1993-10-13 1995-04-25 Furukawa Electric Co Ltd:The Through-hole circuit board and through-hole plating method
JP2017069586A (en) * 2012-01-20 2017-04-06 旭化成株式会社 Multilayer flexible wiring board, and manufacturing method thereof
WO2020003878A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method of manufacturing printed wiring board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3570802B2 (en) 1995-11-14 2004-09-29 三井化学株式会社 Copper thin film substrate and printed wiring board
CN101688308B (en) 2007-07-02 2012-10-10 荏原优莱特科技股份有限公司 Metal-laminated polyimide substrate, and method for production thereof
JP2010272837A (en) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111373A (en) * 1993-10-13 1995-04-25 Furukawa Electric Co Ltd:The Through-hole circuit board and through-hole plating method
JP2017069586A (en) * 2012-01-20 2017-04-06 旭化成株式会社 Multilayer flexible wiring board, and manufacturing method thereof
WO2020003878A1 (en) * 2018-06-26 2020-01-02 Dic株式会社 Method of manufacturing printed wiring board

Also Published As

Publication number Publication date
KR20230104148A (en) 2023-07-07
TW202236907A (en) 2022-09-16
WO2022097485A1 (en) 2022-05-12
JP7332049B2 (en) 2023-08-23
CN116472785A (en) 2023-07-21

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