JPWO2022074945A1 - - Google Patents

Info

Publication number
JPWO2022074945A1
JPWO2022074945A1 JP2022555290A JP2022555290A JPWO2022074945A1 JP WO2022074945 A1 JPWO2022074945 A1 JP WO2022074945A1 JP 2022555290 A JP2022555290 A JP 2022555290A JP 2022555290 A JP2022555290 A JP 2022555290A JP WO2022074945 A1 JPWO2022074945 A1 JP WO2022074945A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022555290A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022074945A1 publication Critical patent/JPWO2022074945A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022555290A 2020-10-07 2021-08-20 Pending JPWO2022074945A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020170183 2020-10-07
PCT/JP2021/030648 WO2022074945A1 (en) 2020-10-07 2021-08-20 Metal particle-containing resin composition

Publications (1)

Publication Number Publication Date
JPWO2022074945A1 true JPWO2022074945A1 (en) 2022-04-14

Family

ID=81125797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555290A Pending JPWO2022074945A1 (en) 2020-10-07 2021-08-20

Country Status (3)

Country Link
JP (1) JPWO2022074945A1 (en)
TW (1) TW202214761A (en)
WO (1) WO2022074945A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003147317A (en) * 2001-11-16 2003-05-21 Hitachi Chem Co Ltd Adhesive resin paste composition and semiconductor device using the same
JP4235887B2 (en) * 2002-06-07 2009-03-11 日立化成工業株式会社 Conductive paste
JP4972955B2 (en) * 2006-02-23 2012-07-11 住友電気工業株式会社 Conductive paste and printed wiring board using the same
JP6636306B2 (en) * 2015-11-27 2020-01-29 日東電工株式会社 Adhesive sheet, dicing tape-integrated adhesive sheet, and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
TW202214761A (en) 2022-04-16
WO2022074945A1 (en) 2022-04-14

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