JPWO2022070910A1 - - Google Patents

Info

Publication number
JPWO2022070910A1
JPWO2022070910A1 JP2022553794A JP2022553794A JPWO2022070910A1 JP WO2022070910 A1 JPWO2022070910 A1 JP WO2022070910A1 JP 2022553794 A JP2022553794 A JP 2022553794A JP 2022553794 A JP2022553794 A JP 2022553794A JP WO2022070910 A1 JPWO2022070910 A1 JP WO2022070910A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022553794A
Other versions
JP7576805B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022070910A1 publication Critical patent/JPWO2022070910A1/ja
Priority to JP2024091175A priority Critical patent/JP2024113075A/ja
Application granted granted Critical
Publication of JP7576805B2 publication Critical patent/JP7576805B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP2022553794A 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線 Active JP7576805B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024091175A JP2024113075A (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020166977 2020-10-01
JP2020166977 2020-10-01
JP2020219193 2020-12-28
JP2020219193 2020-12-28
PCT/JP2021/033865 WO2022070910A1 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024091175A Division JP2024113075A (ja) 2020-10-01 2024-06-05 低温半田、低温半田の製造方法、および低温半田被覆リード線

Publications (2)

Publication Number Publication Date
JPWO2022070910A1 true JPWO2022070910A1 (ja) 2022-04-07
JP7576805B2 JP7576805B2 (ja) 2024-11-01

Family

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Also Published As

Publication number Publication date
KR20230075504A (ko) 2023-05-31
TW202219286A (zh) 2022-05-16
WO2022070910A1 (ja) 2022-04-07
TW202344326A (zh) 2023-11-16
CN116324001A (zh) 2023-06-23
JP2024113075A (ja) 2024-08-21

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