JPWO2022065480A1 - - Google Patents

Info

Publication number
JPWO2022065480A1
JPWO2022065480A1 JP2022552098A JP2022552098A JPWO2022065480A1 JP WO2022065480 A1 JPWO2022065480 A1 JP WO2022065480A1 JP 2022552098 A JP2022552098 A JP 2022552098A JP 2022552098 A JP2022552098 A JP 2022552098A JP WO2022065480 A1 JPWO2022065480 A1 JP WO2022065480A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022552098A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022065480A1 publication Critical patent/JPWO2022065480A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
JP2022552098A 2020-09-28 2021-09-27 Pending JPWO2022065480A1 (US06620308-20030916-C00002.png)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020162411 2020-09-28
PCT/JP2021/035362 WO2022065480A1 (ja) 2020-09-28 2021-09-27 電気剥離性粘着シート、及び電気剥離性粘着シートの使用方法

Publications (1)

Publication Number Publication Date
JPWO2022065480A1 true JPWO2022065480A1 (US06620308-20030916-C00002.png) 2022-03-31

Family

ID=80846711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022552098A Pending JPWO2022065480A1 (US06620308-20030916-C00002.png) 2020-09-28 2021-09-27

Country Status (3)

Country Link
JP (1) JPWO2022065480A1 (US06620308-20030916-C00002.png)
TW (1) TW202225360A (US06620308-20030916-C00002.png)
WO (1) WO2022065480A1 (US06620308-20030916-C00002.png)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
JP5503926B2 (ja) * 2009-08-31 2014-05-28 ビッグテクノス株式会社 電気剥離性粘着製品及びその剥離方法
WO2014157408A1 (ja) * 2013-03-27 2014-10-02 リンテック株式会社 電気剥離性粘着剤組成物、及び電気剥離性粘着シート、並びに電気剥離性粘着シートの使用方法
CN105073938B (zh) * 2013-03-27 2017-11-28 琳得科株式会社 电剥离性粘合剂组合物、电剥离性粘合片、以及电剥离性粘合片的使用方法
CN109037134A (zh) * 2017-06-08 2018-12-18 瀚宇彩晶股份有限公司 可挠式面板以及可挠式面板的制造方法

Also Published As

Publication number Publication date
WO2022065480A1 (ja) 2022-03-31
TW202225360A (zh) 2022-07-01

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